Beta Silicon Carbide Abrasive Powder D50 0.5μm ATOMFAIR®

Price range: $189.00 through $599.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

3C-SiC beta silicon carbide abrasive powder with D50 0.5 μm, D10 0.08 μm, D90 0.95 μm and 0.80 ± 0.1 g/cm3 tap density. Order now.

SKU: AF-FM-C-SICW-050W-SP00
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Atomfair Beta Silicon Carbide Fine Abrasive Powder (3C-SiC), D50 0.5 μm


Atomfair Beta Silicon Carbide Fine Abrasive Powder (3C-SiC), D50 0.5 μm

Product Description

Atomfair Beta Silicon Carbide Fine Abrasive Powder (3C-SiC) is supplied with a D50 0.5 μm particle-size specification and high natural bulk density. It is intended for precision grinding, lapping, polishing, and abrasive-processing research.

Technical Specifications
Parameter Specification / Available Values
Product Beta Silicon Carbide Fine Abrasive Powder (3C-SiC)
Material Silicon carbide
Chemical Formula SiC
Crystal Phase / Structure Cubic beta-SiC (3C-SiC)
Basic Grain Content 60%-80%
D10 0.08 μm
D50 (Median Particle Size) 0.5 μm
D90 0.95 μm
D97 ≤1.5 μm
Tap Density 0.80 ± 0.1 g/cm³ (tap)

Customization & Ordering

Custom particle-size and purity requirements may be evaluated for selected
grades upon request. Alternative package sizes may also be available.
Minimum order quantities, pricing, and lead times vary by specification and
will be confirmed during technical review and quotation.

Key Features and Advantages

  • Defined D50 0.5 μm particle-size grade.
  • High natural bulk density and efficient abrasive-cutting behavior.
  • Lower processed-surface roughness and improved surface-finish performance.
  • Suitable for controlled grinding, lapping, and polishing evaluation.

APPLICATION SCOPE: precision grinding, lapping, polishing, and abrasive-processing research

DOCUMENTATION: COA and SDS can be provided upon request for batch-specific confirmation. Additional documentation requirements may be discussed before order confirmation.

LABORATORY PROCUREMENT SUPPORT

For grade selection, particle-size confirmation, documentation support or custom specification review, contact our technical sales team.

E-MAIL: inquiry@atomfair.com


How does the narrow particle size distribution (D10 0.08 μm, D50 0.5 μm, D90 0.95 μm) of Atomfair Beta SiC powder affect surface finish in lapping applications?

The narrow distribution ensures consistent abrasive action, reducing the risk of deep scratches and achieving lower surface roughness. The D50 of 0.5 μm is specifically targeted for precision polishing, while the tap density of 0.80 g/cm³ supports efficient packing for controlled material removal.

What is the significance of the basic grain content (60%-80%) in beta silicon carbide abrasive powder for research applications?

The basic grain content refers to the proportion of primary crystalline grains in the powder. A higher content (60%-80%) indicates a more consistent abrasive structure, which is critical for reproducible results in controlled grinding and polishing experiments.

What batch-specific documentation is available for Atomfair beta SiC powder to verify particle size and purity?

Certificates of Analysis (COA) and Safety Data Sheets (SDS) can be provided upon request for batch-specific confirmation. This allows researchers to verify particle size distribution and chemical composition before use.

This 3C-SiC fine abrasive powder, with a D50 of 0.5 μm and a narrow particle-size distribution (D10 0.08 μm, D90 0.95 μm, D97 ≤1.5 μm), is engineered for precision grinding, lapping, and polishing applications where controlled material removal and low surface roughness are critical. Its cubic beta-phase structure and high tap density (0.80 ± 0.1 g/cm³) support efficient abrasive cutting and consistent slurry behavior, though the 60%-80% basic grain content and variable package sizes (1 kg, 5 kg) require batch-specific verification for stringent process control.

Positive

  • Defined sub-micron particle size: The D50 of 0.5 μm with a tight distribution (D10 0.08 μm, D90 0.95 μm, D97 ≤1.5 μm) enables predictable abrasive behavior for precision grinding and polishing, supporting controlled material removal and reduced surface roughness.
  • High natural bulk density: A tap density of 0.80 ± 0.1 g/cm³ indicates efficient particle packing, which can improve slurry stability and abrasive cutting efficiency in lapping and polishing processes.

Trade-offs

  • Variable basic grain content: The basic grain content is specified as 60%-80%, meaning batch-to-batch variability in active abrasive fraction may require COA verification and process recalibration for applications demanding strict consistency.
  • Package size constraints: Available only in 1 kg and 5 kg packages, which may limit scalability for high-volume industrial use; custom packaging requires technical review and may affect lead times.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Package

1kg, 5kg

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