Atomfair Silicon Dioxide Polishing Dispersion, 30 nm, 30% Solid Content, Water-Based
Product Description
Atomfair silicon dioxide polishing dispersion is supplied as white emulsion with a particle size of 30 nm, 30% solid content, water as the listed solvent. It is intended for precision polishing.
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Technical Specifications
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Customization & Ordering
Custom specifications, quantities, and packaging may be available upon request. Submit the required specification and delivery timeline through Request a Quote.
Key Features and Advantages
- Particle size: 30 nm
- Solid Content: 30%
- Solvent: Water
APPLICATION SCOPE: precision polishing.
DOCUMENTATION: COA and SDS can be provided upon request for batch-specific confirmation.
LABORATORY PROCUREMENT SUPPORT
For grade selection, particle-size confirmation, documentation support or custom specification review, contact our technical sales team.
Does Atomfair offer custom particle size, solid content, or packaging for its 30 nm silica polishing dispersion?
The standard Atomfair silicon dioxide polishing dispersion is supplied as a 30 nm particle size, 30% solid content, water-based white emulsion intended for precision polishing, with standard package sizes of 100 g, 250 g, 500 g, and 1 kg. Custom specifications, quantities, and packaging may be available upon request through the Request a Quote process, and the technical sales team can review custom specification and delivery timeline requirements.
For which polishing application is the Atomfair 30 nm silica dispersion intended, and is substrate compatibility stated?
The product is intended for precision polishing. No specific substrate, equipment, or process compatibility is stated in the product description, so application fit should be confirmed through the technical sales team, which supports grade selection, particle-size confirmation, and custom specification review.
Can batch-specific COA and SDS documentation be provided for this Atomfair silica polishing dispersion?
Yes. COA and SDS can be provided upon request for batch-specific confirmation. The technical sales team is also available for documentation support and procurement-related questions.
This 30 nm silicon dioxide polishing dispersion in water is designed for precision polishing, offering a controlled particle size and 30% solid content for consistent surface finishing. The water-based solvent reduces environmental and safety concerns compared to organic-based alternatives.
Positive
- 30 nm particle size for fine polishing: The 30 nm particle size enables precision surface finishing, reducing roughness in semiconductor and optical component polishing.
- Water-based solvent improves safety: Using water as the solvent eliminates the need for organic solvent handling, lowering toxicity, flammability, and disposal costs in the lab.
Trade-offs
- Application limited to precision polishing: The product is specifically formulated for precision polishing and may not be effective for bulk material removal or general abrasion tasks.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
