Atomfair Atomfair Spherical Agglomerated Hexagonal Boron Nitride (h-BN) Powder, D50 360 μm
Product Description
Atomfair hexagonal boron nitride (h-BN) powder is supplied as spherical, layered agglomerates formed from loosely compacted hexagonal boron nitride platelets, with a D50 particle size of 360 μm and a tap density of 0.4–0.6 g/cm³. It is intended for thermal-interface-material research.
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Technical Specifications
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Customization & Ordering
Custom specifications, quantities, or packaging may be available upon request. Please submit your target specifications, required quantity, packaging requirements, and delivery timeline through Request a Quote.
Key Features and Advantages
- Morphology: Spherical, layered agglomerates formed from loosely compacted hexagonal boron nitride platelets.
- Specified D50 particle size: 360 μm.
- Specified tap density: 0.4–0.6 g/cm³.
APPLICATION SCOPE: thermal-interface-material research.
DOCUMENTATION: COA and SDS can be provided upon request for batch-specific confirmation.
LABORATORY PROCUREMENT SUPPORT
For grade selection, particle-size confirmation, documentation support or custom specification review, contact our technical sales team.
How does the tap density of 0.4–0.6 g/cm³ affect the thermal conductivity of TIM formulations using this spherical agglomerated h-BN powder?
The specified tap density of 0.4–0.6 g/cm³ indicates a relatively low packing density of the loosely compacted agglomerates, which can influence the filler loading and thermal percolation in thermal interface materials. Lower tap density may require higher loading fractions to achieve continuous heat conduction pathways, but the spherical morphology can improve flow and dispersion during processing.
What are the practical constraints of using a D50 of 360 μm spherical agglomerated h-BN powder in thin thermal interface material layers?
With a D50 particle size of 360 μm, the agglomerates are relatively large, which may limit their use in thin bond-line applications where the filler size must be smaller than the final gap thickness to avoid incomplete wetting or mechanical stress. The spherical agglomerated morphology can help reduce viscosity at high loadings, but the particle size must be matched to the intended layer thickness.
What documentation is available for batch-specific confirmation of this hexagonal boron nitride powder's purity and particle size?
A Certificate of Analysis (COA) and Safety Data Sheet (SDS) can be provided upon request for batch-specific confirmation of specifications such as the D50 particle size, tap density, and water-soluble boron content (0.10%). The product is intended for thermal-interface-material research, and documentation supports traceability and quality assurance.
Spherical agglomerated h-BN powder with D50 360 μm and tap density 0.4–0.6 g/cm³, specifically for thermal-interface-material research. Its loose platelet structure aids dispersion, but the low tap density and 0.10% water-soluble boron content are practical considerations.
Positive
- Spherical agglomerate morphology: Loose packing of hexagonal platelets into spherical agglomerates improves powder flow and mixing uniformity in thermal-interface-material formulations.
- Specified D50 and tap density: A D50 of 360 μm and tap density of 0.4–0.6 g/cm³ provide predictable particle-size distribution and packing behavior for research-scale TIM development.
Trade-offs
- Low tap density: Tap density of 0.4–0.6 g/cm³ indicates low bulk density, requiring larger volume per gram, which may increase filler loading volume in composites.
- Water-soluble boron content: Water-soluble boron at 0.10% may affect formulations sensitive to ionic impurities or moisture-driven degradation.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
