Atomfair Atomfair Spherical Agglomerated Hexagonal Boron Nitride (h-BN) Powder, D50 135 μm
Product Description
Atomfair hexagonal boron nitride (h-BN) powder is supplied as spherical, layered agglomerates formed from loosely compacted hexagonal boron nitride platelets, with a D50 particle size of 135 μm and a tap density of 0.4–0.6 g/cm³. It is intended for thermal-interface-material research.
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Technical Specifications
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Customization & Ordering
Custom specifications, quantities, or packaging may be available upon request. Please submit your target specifications, required quantity, packaging requirements, and delivery timeline through Request a Quote.
Key Features and Advantages
- Morphology: Spherical, layered agglomerates formed from loosely compacted hexagonal boron nitride platelets.
- Specified D50 particle size: 135 μm.
- Specified tap density: 0.4–0.6 g/cm³.
APPLICATION SCOPE: thermal-interface-material research.
DOCUMENTATION: COA and SDS can be provided upon request for batch-specific confirmation.
LABORATORY PROCUREMENT SUPPORT
For grade selection, particle-size confirmation, documentation support or custom specification review, contact our technical sales team.
How does the spherical agglomerated morphology and D50 of 135 μm influence the thermal conductivity and filler loading in polymer-based thermal interface materials?
The spherical agglomerates, formed from loosely compacted h-BN platelets, enable higher filler loading and improved flowability compared to irregular platelet powders. The specified D50 of 135 μm and tap density of 0.4–0.6 g/cm³ indicate a controlled particle size distribution that can optimize packing density and thermal percolation in composite formulations. The water-soluble boron content of 0.10% is minimal, suggesting low ionic contamination risk for electronic applications.
What are the key factors to consider when integrating this h-BN powder into silicone or epoxy resins for thermal interface materials?
The loose agglomerate structure may require gentle mixing to avoid breakage, preserving the spherical morphology that aids in uniform dispersion. The specified tap density range (0.4–0.6 g/cm³) and D50 of 135 μm are critical for achieving target filler loadings without excessive viscosity. The low water-soluble boron (0.10%) minimizes potential corrosion or outgassing issues in encapsulated electronics.
What documentation and quality control data are available for this h-BN powder to ensure batch-to-batch consistency?
A Certificate of Analysis (COA) and Safety Data Sheet (SDS) can be provided upon request for batch-specific confirmation of particle size, purity, and other parameters. The manufacturer, Atomfair LLC, offers technical support for grade selection and particle-size confirmation.
Spherical agglomerated h-BN powder with a D50 of 135 μm and tap density 0.4–0.6 g/cm³ is evaluated for thermal-interface-material research, balancing controlled particle architecture against water-soluble boron and packing density considerations.
Positive
- Spherical agglomerate morphology: Spherical, layered agglomerates of h-BN platelets promote isotropic thermal conductivity and improved packing in thermal interface material formulations.
- Controlled particle size and density: Specified D50 of 135 μm and tap density of 0.4–0.6 g/cm³ enable reproducible composite loading and predictable thermal performance.
Trade-offs
- Water-soluble boron content: The 0.10% water-soluble boron fraction may introduce ionic impurities that could affect electrical insulation or long-term stability in humid environments.
- Low tap density: Tap density of 0.4–0.6 g/cm³ is relatively low, requiring larger fill volumes and potentially affecting dispersion uniformity in high-loading composites.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
