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Silicon(N-type) (Si(N-type)) Evaporation Material, Pieces, 99.9%, 1-3 mm
Product Type: Compound Evaporation Material
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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Silicon(N-type) evaporation material in pieces is intended for vacuum thin-film deposition using electron-beam evaporation. Deposition requires an E-beam hearth with a compatible liner, Tantalum sheet hardware, and a high-temperature crucible for thermal evaporation by RFQ.
- Deposition Method Preference: E-beam evaporation is the preferred method, with thermal evaporation available only by RFQ.
- Hardware Compatibility: The evaporation source must use a Tantalum sheet liner and a compatible E-beam hearth crucible.
- Process Control Parameters: The melting point of 1410°C and Z-ratio of 0.712 must be used to calibrate the deposition rate and thickness monitor.
- Material Form and Loading: The 1–3 mm pieces must be loaded into the crucible with care to ensure uniform melt and consistent evaporation.
Why is E-beam evaporation recommended for N-type silicon pieces despite a 'Fair' performance rating?
E-beam evaporation is the preferred method for Silicon(N-type) pieces, but its performance is rated as 'Fair' when using an E-beam hearth with a compatible liner. Thermal evaporation feasibility requires an RFQ, and high-temperature crucibles are available by RFQ. The 'Fair' rating indicates that careful process optimization may be needed to achieve consistent film quality with this material.
What hardware configuration is specified for depositing this N-type silicon evaporation material?
The product specification recommends an E-beam hearth with a compatible liner and notes that Tantalum sheet hardware (Sheet2 hardware) is available. For thermal evaporation, high-temperature crucibles are available by RFQ. The exact liner material is not listed, so buyers should confirm compatibility with their specific deposition system before ordering.
How does the melting point of 1,410 °C influence crucible and process selection for this N-type silicon material?
The melting point is 1,410 °C, with a density of 2.32 g/cm³ and Z-Ratio of 0.712. For thermal evaporation (RFQ-based), a high-temperature crucible is required; for E-beam evaporation, a compatible liner is recommended. These physical parameters must be considered when matching the evaporation source and monitoring equipment to achieve stable deposition.
This n-type silicon evaporation material is supplied as 1–3 mm pieces with 99.9% purity, suitable for e-beam deposition with fair performance; thermal evaporation requires RFQ. The high melting point (1410°C) and crucible compatibility requirements must be considered for lab deployment.
Positive
- Defined n-type silicon composition: Silicon(N-type) provides a controlled dopant type for semiconductor thin-film applications, ensuring consistent electrical properties in deposited layers.
- Specified piece size for loading: The 1–3 mm piece size range is optimized for loading into e-beam hearths and crucibles, balancing surface area for evaporation with handling stability.
Trade-offs
- E-beam evaporation constraint: E-beam performance is rated as 'Fair' and thermal evaporation requires RFQ confirmation, limiting process flexibility without prior qualification.
- High melting point and infrastructure needs: With a melting point of 1410°C, the material requires high-temperature crucibles and compatible liners, increasing equipment demands and potential for contamination.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
