Copper Oxide Cu2O Evaporation Powder 99.5%, <77 nm ATOMFAIR®

This evaporation material requires e-beam deposition with specific liner materials to avoid contamination and ensure uniform film formation. Thermal evaporation is only permitted after RFQ confirmation due to potential material behavior issues.

• Evaporation Source Compatibility: Use only e-beam evaporation with a hearth liner of graphite, Al2O3, or BN, or a boat made of W, Mo, or Ta.
• Thermal Evaporation Restriction: Thermal evaporation is not recommended unless explicitly approved via RFQ, as e-beam performance is rated as Good.
• Particle Size Consideration: The powder particle size of less than 77 nm must be confirmed to be compatible with the deposition source loading mechanism to prevent clogging.
• Material Behavior Matching: Match the evaporation source hardware and process route to the material's melting point, density, and Z-ratio to achieve required film properties.
• Procurement Verification: Verify model, purity, form, size range, pack size, and deposition-source compatibility before ordering to ensure laboratory suitability.

Atomfair technical evaluation of Copper Oxide (Cu2O) evaporation material (99.5%, <77 nm powder) confirms suitability for e-beam deposition applications requiring defined particle size and purity, with the caveat that thermal evaporation requires RFQ and source compatibility must be verified.

Positive

• Sub-77 nm particle size for uniform films: The powder particle size of < 77 nm enables fine control and uniformity in thin film deposition, particularly for e-beam evaporation.
• Defined material identity and purity: Copper Oxide (Cu2O) with 99.5% purity allows clear procurement matching for research-grade vacuum deposition processes.

Trade-offs

• Deposition source compatibility required: The material requires specific e-beam hearth liners (graphite, Al2O3, BN) or boats (W, Mo, Ta); thermal evaporation is only available by RFQ, limiting process flexibility.
• Powder form handling considerations: As a sub-77 nm powder, the material requires careful handling to avoid airborne contamination, moisture uptake, and aggregation during storage and deposition source loading.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).