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P type Monocrystalline Silicon Wafer – 4 inch (100 mm) <100> Single-Side Polished
Product Type: Silicon wafer
Research-grade laboratory product
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PRODUCT SELECTION SUPPORT
For model selection, material matching or specification support, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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What are the geometric tolerances (TTV, BOW, WARP) for the 4-inch <100> silicon wafer?
The wafer has TTV <10 µm, BOW <10 µm, and WARP <15 µm, ensuring consistent flatness critical for photolithography and bonding processes.
What is the surface finish and backside condition of the 4-inch single-side polished silicon wafer?
The front side is polished to a roughness Ra <0.5 nm, and the back side is etched, providing a clean surface for epitaxial deposition and device fabrication.
What resistivity ranges are available for the P-type <100> silicon wafer?
P-type resistivity is selectable from 0.001-0.005 ohm.cm, 1-10 ohm.cm, >10 ohm.cm, >5K ohm.cm, and >10K ohm.cm, accommodating different doping requirements for various device applications.
This 4-inch P-type <100> monocrystalline silicon wafer offers 6N purity, single-side polished finish, and tight geometric tolerances (TTV <10 µm, BOW <10 µm, WARP <15 µm) suitable for research-grade device fabrication. The selectable resistivity range and CZ/FZ material options provide flexibility for varied applications, but the single-side polished surface and smaller diameter limit compatibility with double-sided processes and modern automated handling tools.
Positive
- High-purity 6N monocrystalline silicon: The wafer is fabricated from 6N (99.9999%) purity monocrystalline silicon via CZ or FZ methods, ensuring minimal contamination for sensitive electronic and photonic applications.
- Tight geometric tolerances: With TTV <10 µm, BOW <10 µm, WARP <15 µm, and front-side roughness Ra <0.5 nm, the wafer offers excellent planarity and surface quality for lithography and thin-film deposition.
Trade-offs
- Single-side polished finish: Only the front side is polished (Ra <0.5 nm); the back side is etched, which may require additional processing for applications requiring double-side polished surfaces.
- Smaller 4-inch diameter: The 100 mm diameter is smaller than standard 200/300 mm wafers, potentially limiting compatibility with automated handling and processing equipment in modern semiconductor fabs.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
