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P type Monocrystalline Silicon Wafer – 6 inch (150 mm) <100> Single-Side Polished
Product Type: Silicon wafer
Research-grade laboratory product
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E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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What are the flatness and thickness tolerances of the 6-inch <100> P-type monocrystalline silicon wafer?
The wafer has a typical thickness of 625 ± 25 µm with total thickness variation (TTV) <10 µm, bow (BOW) <15 µm, and warp (WARP) <20 µm. These tight tolerances ensure high uniformity for lithographic alignment and thin-film deposition in semiconductor processing.
What resistivity ranges are available for this P-type silicon wafer and how do they affect device performance?
Selectable resistivity values include 0.001–0.005 ohm·cm, 1–10 ohm·cm, >10 ohm·cm, >5K ohm·cm, and >10K ohm·cm. Low resistivity is suited for power devices, while high resistivity (>5K ohm·cm) is preferred for RF and high-frequency applications to minimize substrate losses.
What are the surface finish and roughness specifications critical for this single-side polished wafer?
The front-side polished surface has a roughness of Ra <0.5 nm, suitable for epitaxial growth or photolithography. The back side is etched, providing a non-polished surface that requires careful handling to avoid particle contamination during processing.
This 6-inch monocrystalline silicon wafer offers high-purity 6N CZ/FZ material with tight geometric tolerances (TTV <10 µm, BOW <15 µm, WARP <20 µm) and front-side roughness <0.5 nm, suitable for research and device fabrication, but the single-side polished finish and ±25 µm thickness tolerance impose operational constraints for double-sided or ultra-precision applications.
Positive
- High-purity monocrystalline silicon: 6N purity CZ/FZ material ensures low defect density and consistent electronic properties for demanding semiconductor and photonics research.
- Tight geometric tolerances: TTV <10 µm, BOW <15 µm, and WARP <20 µm provide excellent wafer flatness and uniformity, critical for lithographic alignment and thin-film deposition processes.
Trade-offs
- Single-side polished only: The back side is etched rather than polished, which may limit use in double-sided processing or optical transmission applications requiring both sides specular.
- Thickness tolerance of ±25 µm: The 625 µm typical thickness with ±25 µm tolerance may constrain applications requiring tighter thickness control, such as resonant cavity or MEMS devices.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
