Atomfair Hexagonal Boron Nitride (h-BN) Powder, Dense Agglomerated Morphology, D50 22 μm
Product Description
Atomfair hexagonal boron nitride (h-BN) powder is supplied as dense, irregular agglomerates formed from stacked boron nitride platelets, with a D50 particle size of 22 μm and a tap density of 0.6 g/cm³. It is intended for thermally conductive and electrically insulating formulation research.
Technical Specifications
| PARAMETER DETAILS | |
|---|---|
| Product | Hexagonal Boron Nitride (h-BN) Powder |
| Chemical Formula | BN |
| Structure / Phase | Hexagonal boron nitride (h-BN) |
| Morphology | Dense, irregular agglomerates formed from stacked boron nitride platelets |
| D50 Particle Size | 22 μm |
| Specific Surface Area | 2.0 m2/g |
| Tap Density | 0.6 g/cm3 |
Customization & Ordering
Custom specifications, quantities, or packaging may be available upon request. Please submit your target specifications, required quantity, packaging requirements, and delivery timeline through Request a Quote.
Key Features and Advantages
- Morphology: Dense, irregular agglomerates formed from stacked boron nitride platelets.
- Specified D50 particle size: 22 μm.
- Specified specific surface area: 2.0 m²/g.
APPLICATION SCOPE: thermally conductive and electrically insulating formulation research.
DOCUMENTATION: COA and SDS can be provided upon request for batch-specific confirmation.
TAILORED SOLUTIONS FOR RESEARCH
Contact our engineering team for technical support or official institutional quotations.
How does the dense agglomerated morphology and D50 particle size of 22 μm influence the thermal conductivity and electrical insulation performance of this h-BN powder?
The dense agglomerated morphology, composed of stacked boron nitride platelets, contributes to a tap density of 0.6 g/cm³ and a specific surface area of 2.0 m²/g. A D50 of 22 μm provides a balance between filler packing density and dispersion, which can affect the thermal conductivity and electrical insulation properties in composite formulations.
What types of formulation research is this hexagonal boron nitride powder designed for?
This h-BN powder is specifically intended for thermally conductive and electrically insulating formulation research. It is suitable for developing polymer composites, thermal interface materials, and dielectric fillers where high thermal conductivity and electrical insulation are required.
Is batch-specific documentation available for this h-BN powder?
Yes, a Certificate of Analysis (COA) and Safety Data Sheet (SDS) can be provided upon request to confirm batch-specific properties and safety handling information.
Atomfair h-BN powder with dense agglomerated morphology, D50 22 μm, and specific surface area 2.0 m²/g is evaluated for thermally conductive and electrically insulating formulation research, offering controlled particle characteristics for composite development.
Positive
- Controlled D50 and surface area: Specified D50 of 22 μm and specific surface area of 2.0 m²/g ensure consistent particle characteristics for reproducible formulation studies.
- Designed for thermal and insulating applications: The dense agglomerated morphology of stacked h-BN platelets is intended for thermally conductive and electrically insulating formulation research, leveraging h-BN's inherent properties.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
