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Atomfair® GRCop-42 spherical copper-chromium-niobium alloy powder displaying a deep reddish-brown metallic texture inside a transparent hexagonal glass sample bottle.

GRCOP-42 Spherical CuCrNb Alloy Powder 15-53μm ATOMFAIR®

$592.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research grade GRCOP-42 spherical CuCrNb alloy powder, 15-53μm, O ≤0.04%, D50 30-40μm, ≥330 W/(m·K) thermal conductivity for AM heat exchangers. Order now.

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ATOMFAIR® GRCOP-42

RESEARCH GRADE MATERIAL

Product Overview
Optimize structural consistency and mechanical reliability in high-temperature component validation using our premier spherical alloy framework. This powder system establishes superior layer-to-layer integrity during additive manufacturing, eliminating microstructural variance and serving as a stable high-performance baseline platform to meet targeted industrial pricing milestones.

Technical Specifications

PARAMETER DETAILS
1. Chemical Composition (wt.%)
Copper (Cu) / Chromium (Cr) Balance / 3.1 – 3.4%
Niobium (Nb) / Iron (Fe) 2.7 – 3.0% / <0.005%
Silicon (Si) / Aluminum (Al) <0.01% / <0.01%
Oxygen (O) ≤0.04%
2. Core Physical Design & Properties
Particle Size Range D10 ≥15 μm
Particle Size Range D50 30 – 40 μm
Particle Size Range D90 ≤60 μm
Sphericity ≥0.90
Apparent Density ≥4.3 g/cm³
Tap Density ≥5.0 g/cm³
Flowability ≤25 s/50g
3. Heat-Treated Mechanical & Functional Performance Properties
Tensile Strength (Room Temp.) ≥350 MPa
Yield Strength (Room Temp.) ≥180 MPa
Elongation (Room Temp.) ≥30.0%
Thermal Conductivity (Room Temp.) ≥330 W/(m·K)
Electrical Conductivity ≥85% IACS
Manufacturing Rules Processed under strict aerospace industry standards conditions
Alternative Options Explore our related catalog or custom dimensions. For urgent technical custom requests or bulk inquiries, please contact our support team.

Key Features & Advantages
  • Homogeneous Material Purity: Features an uncompromised structural configuration with highly uniform elemental distribution across the matrix.
  • Enhanced Operational Efficiency: Specifically engineered to demonstrate superior electrochemical performance, significantly boosting transfer kinetics at targeted bands.
  • Optimized Sintering/Microstructure: Advanced synthesis allows for lower required operating temperatures and ideal grain boundary integration during cell fabrication.

APPLICATION SCOPE: Highly optimized for manufacturing engine combustion chamber parts, heat exchangers, induction coils, and precision structural systems requiring high thermal management capability.
PACKAGING: Sealed argon-filled protective bottles or specialized vacuum containment drums.
IMPORTANT NOTICE: This product is highly sensitive to ambient exposure. Keep containers tightly sealed or handle exclusively within an anhydrous inert gas environment to prevent phase contamination or degradation before thermal validation.
TAILORED SOLUTIONS FOR RESEARCH
Contact our engineering team for technical support or official institutional quotations.
EMAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

This powder requires strict inert gas atmosphere handling to prevent phase contamination and degradation. Storage must be in sealed argon-filled or vacuum containers to maintain material integrity.

  • Ambient Exposure Sensitivity: Store and handle this powder exclusively within an anhydrous inert gas environment to avoid oxygen and moisture contamination.
  • Processing Atmosphere Requirement: All additive manufacturing and thermal processing must be conducted under inert gas conditions to prevent oxidation and preserve mechanical properties.
  • Packaging and Sealing: Keep containers tightly sealed until transfer into a controlled atmosphere, using only the supplied argon-filled or vacuum packaging.
  • Aerospace Manufacturing Standards: The powder is processed under strict aerospace industry standards, requiring validated quality control during handling and fabrication.
  • Thermal Processing Constraints: Optimize sintering at lower temperatures to achieve proper grain boundary integration and avoid microstructural defects.

How does the oxygen content limit of ≤0.04% in ATOMFAIR GRCOP-42 affect its thermal and electrical conductivity performance?

The oxygen content is strictly limited to ≤0.04% to minimize oxide formation, which can degrade both thermal and electrical conductivity. The product achieves ≥330 W/(m·K) thermal conductivity and ≥85% IACS electrical conductivity, consistent with the low oxygen specification. This ensures high transfer kinetics for applications like heat exchangers and induction coils.

What particle size distribution and sphericity are required for successful laser powder bed fusion of ATOMFAIR GRCOP-42?

The powder has a particle size range of D10 ≥15 μm, D50 30–40 μm, and D90 ≤60 μm, with sphericity ≥0.90. This distribution is optimized for consistent layer spreading and dense packing in additive manufacturing. The high sphericity ensures good flowability (≤25 s/50g) and minimizes microstructural variance during printing.

What are the recommended storage and handling conditions to prevent oxidation of ATOMFAIR GRCOP-42 copper alloy powder?

The product is highly sensitive to ambient exposure and must be stored in sealed argon-filled bottles or vacuum containment drums. Handling should be performed exclusively within an anhydrous inert gas environment to prevent phase contamination or degradation before thermal validation. This is critical to maintain the specified chemical composition and mechanical properties.

GRCOP-42 is a research-grade spherical Cu-Cr-Nb powder (D50 30–40 μm, sphericity ≥0.90) delivering high thermal conductivity (≥330 W/(m·K)) and electrical conductivity (≥85% IACS) after heat treatment, suited for additive manufacturing of thermal-management components; its ambient sensitivity requires anhydrous inert handling until thermal validation.

Positive

  • Spherical powder designed for layer integrity: With D50 of 30–40 μm, sphericity ≥0.90, flowability ≤25 s/50g, and tap density ≥5.0 g/cm³, the powder supports consistent layer-to-layer integrity and is intended to reduce microstructural variance in additive manufacturing.
  • High thermal and electrical conductivity after heat treatment: Heat-treated properties include tensile strength ≥350 MPa, yield strength ≥180 MPa, elongation ≥30%, thermal conductivity ≥330 W/(m·K), and electrical conductivity ≥85% IACS, supporting use in high-thermal-management components.

Trade-offs

  • Ambient exposure sensitivity: The material is explicitly noted as highly sensitive to ambient exposure; containers must remain sealed or handling must occur only in an anhydrous inert gas environment to prevent phase contamination or degradation before thermal validation.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

size

1kg15-53μm

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