CuSn10 Spherical Bronze Alloy Powder 15–150μm ATOMFAIR®

Price range: $250.00 through $255.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research-grade CuSn10 spherical bronze powder, 1 kg at 15–53 μm or 53–150 μm, with ≥99.5% relative density and ≤25 s/50g flowability. Order now.

ATOMFAIR® CUSN10

RESEARCH GRADE MATERIAL

Product Overview

Optimize structural consistency and mechanical reliability in high-temperature component validation using our premier spherical alloy framework. This powder system establishes superior layer-to-layer integrity during additive manufacturing, eliminating microstructural variance and serving as a stable high-performance baseline platform to meet targeted industrial pricing milestones.

Technical Specifications

PARAMETER DETAILS
1. Chemical Composition (wt.%)
Copper (Cu) / Tin (Sn) Balance / 9.0 – 11.5%
Phosphorus (P) / Nickel (Ni) ≤1.0% / ≤0.10%
Silicon (Si) / Antimony (Sb) ≤0.02% / ≤0.05%
Iron (Fe) / Lead (Pb) ≤0.1% / ≤0.25%
Aluminum (Al) / Zinc (Zn) ≤0.01% / ≤0.05%
Manganese (Mn) / Sulfur (S) / Oxygen (O) ≤0.05% / ≤0.05% / ≤0.1%
2. Core Physical Design & Properties
Particle Size Range D10 ≥15 μm
Particle Size Range D50 30 – 40 μm
Particle Size Range D90 ≤60 μm
Sphericity ≥0.90
Apparent Density ≥4.2 g/cm³
Tap Density ≥4.5 g/cm³
Flowability ≤25 s/50g
3. As-Deposited Mechanical Parameters (Room Temperature)
Tensile Strength ≥520 MPa
Yield Strength ≥400 MPa
Elongation ≥30.0%
Relative Density ≥99.5%
Hardness ≥170 HV
Manufacturing Rules Processed under strict aerospace and mechanical industries standards
Alternative Options Explore our related catalog or custom dimensions. For urgent technical custom requests or bulk inquiries, please contact our support team.

Key Features & Advantages

  • Homogeneous Material Purity: Features an uncompromised structural configuration with highly uniform elemental distribution across the matrix.
  • Enhanced Operational Efficiency: Specifically engineered to demonstrate superior electrochemical performance, significantly boosting transfer kinetics at targeted bands.
  • Optimized Sintering/Microstructure: Advanced synthesis allows for lower required operating temperatures and ideal grain boundary integration during cell fabrication.

APPLICATION SCOPE: Used for manufacturing wear-resistant parts operating under high load, high sliding speed, and elevated temperatures, such as blades, gears, and other complex structures in aerospace and mechanical engineering applications.
PACKAGING: Sealed argon-filled protective bottles or specialized vacuum containment drums.
IMPORTANT NOTICE: This product is highly sensitive to ambient exposure. Keep containers tightly sealed or handle exclusively within an anhydrous inert gas environment to prevent phase contamination or degradation before thermal validation.
TAILORED SOLUTIONS FOR RESEARCH
Contact our engineering team for technical support or official institutional quotations.
EMAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

This documentation defines handling and storage constraints for the ATOMFAIR CUSN10 copper-tin alloy powder. The material must be protected from ambient exposure until it is ready for thermal validation.

  • Ambient Exposure Control: Keep containers tightly sealed or handle the powder exclusively within an anhydrous inert gas environment to prevent phase contamination or degradation before thermal validation.
  • Containment Requirements: Store the powder in sealed argon-filled protective bottles or specialized vacuum containment drums.
  • Thermal Validation Readiness: Ensure that the powder has not been exposed to ambient atmosphere before thermal validation.

This procedure defines controlled handling steps for the ATOMFAIR CUSN10 copper-tin alloy powder. The objective is to prevent ambient exposure and preserve powder integrity before thermal validation.

  1. Transfer under inert gas
    Transfer the powder only inside an anhydrous inert gas environment when handling is required.
  2. Maintain seal
    Keep the container tightly sealed whenever the powder is not being handled.
  3. Return to protective containment
    Store the powder in sealed argon-filled protective bottles or specialized vacuum containment drums.

What tensile and yield strength can be expected from ATOMFAIR CUSN10 as-deposited parts?

As-deposited parts from ATOMFAIR CUSN10 exhibit a tensile strength of ≥520 MPa, yield strength of ≥400 MPa, elongation of ≥30%, and hardness of ≥170 HV, with a relative density of ≥99.5%. These parameters are specified at room temperature and reflect the powder's high-performance baseline for aerospace and mechanical components.

What are the key particle size distribution and flowability characteristics of ATOMFAIR CUSN10 for additive manufacturing?

The powder has a D10 of ≥15 μm, D50 in the range 30–40 μm, and D90 of ≤60 μm, with a sphericity of ≥0.90. It also features an apparent density of ≥4.2 g/cm³, tap density of ≥4.5 g/cm³, and flowability of ≤25 s/50g, ensuring consistent layer-to-layer deposition and microstructural uniformity during AM processes.

How should ATOMFAIR CUSN10 powder be stored and handled to prevent oxidation or contamination?

ATOMFAIR CUSN10 is highly sensitive to ambient exposure and must be kept in tightly sealed containers or handled exclusively within an anhydrous inert gas environment to prevent phase contamination or degradation. The product is supplied in argon-filled protective bottles or specialized vacuum containment drums to maintain its integrity until thermal validation.

Atomfair CUSN10 is a spherical CuSn10 bronze alloy powder (Cu balance, 9.0–11.5% Sn) designed for additive manufacturing of wear-resistant components operating under high load, sliding speed, and elevated temperatures. The powder exhibits high sphericity (≥0.90), controlled particle size distribution (D50 30–40 μm), and good flowability (≤25 s/50g), enabling dense (>99.5%) as-deposited parts with tensile strength ≥520 MPa and elongation ≥30%. However, strict inert atmosphere handling is required to prevent oxidative degradation.

Positive

  • Uniform elemental distribution: Homogeneous material purity with highly uniform elemental distribution across the matrix ensures consistent mechanical properties and reliable layer-to-layer integrity in additive manufacturing.
  • Optimized sintering behavior: Advanced synthesis enables lower required operating temperatures and ideal grain boundary integration during cell fabrication, improving process efficiency and final part microstructure.

Trade-offs

  • Ambient exposure sensitivity: The powder is highly sensitive to ambient air; containers must be kept tightly sealed and handling should occur exclusively in an anhydrous inert gas environment to prevent phase contamination or degradation.
  • Specialized packaging required: Product is supplied in sealed argon-filled protective bottles or specialized vacuum containment drums, requiring careful storage and handling procedures to maintain material integrity before use.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

size

1kg15-53μm, 1kg53-150μm