CuCrZr Spherical Alloy Powder 15-150μm Research ATOMFAIR®

Price range: $272.00 through $283.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research grade CuCrZr spherical alloy powder, 1 kg in 15-53μm or 53-150μm, with ≥0.90 sphericity and ≥85% IACS conductivity. Order now.

ATOMFAIR® CUCRZR

RESEARCH GRADE MATERIAL

Product Overview

Optimize structural consistency and mechanical reliability in high-temperature component validation using our premier spherical alloy framework. This powder system establishes superior layer-to-layer integrity during additive manufacturing, eliminating microstructural variance and serving as a stable high-performance baseline platform to meet targeted industrial pricing milestones.

Technical Specifications

PARAMETER DETAILS
1. Chemical Composition (wt.%)
Copper (Cu) / Chromium (Cr) Balance / 0.5 – 1.5%
Zirconium (Zr) / Iron (Fe) 0.05 – 0.25% / ≤0.15%
Silicon (Si) / Oxygen (O) ≤0.1% / ≤0.1%
Nitrogen (N) ≤0.05%
2. Core Physical Design & Properties
Particle Size Range D10 ≥15 μm
Particle Size Range D50 30 – 40 μm
Particle Size Range D90 ≤60 μm
Sphericity ≥0.90
Apparent Density ≥4.4 g/cm³
Tap Density ≥5.2 g/cm³
Flowability ≤22 s/50g
3. Heat-Treated Mechanical & Functional Performance Properties
Tensile Strength (Room Temp.) ≥350 MPa
Yield Strength (Room Temp.) ≥250 MPa
Elongation (Room Temp.) ≥30.0%
Thermal Conductivity (Room Temp.) ≥280 W/(m·K)
Thermal Conductivity (100°C) ≥300 W/(m·K)
Electrical Conductivity ≥85% IACS
Manufacturing Rules Processed under strict aerospace industry standards conditions
Alternative Options Explore our related catalog or custom dimensions. For urgent technical custom requests or bulk inquiries, please contact our support team.

Key Features & Advantages

  • Homogeneous Material Purity: Features an uncompromised structural configuration with highly uniform elemental distribution across the matrix.
  • Enhanced Operational Efficiency: Specifically engineered to demonstrate superior electrochemical performance, significantly boosting transfer kinetics at targeted bands.
  • Optimized Sintering/Microstructure: Advanced synthesis allows for lower required operating temperatures and ideal grain boundary integration during cell fabrication.

APPLICATION SCOPE: Highly optimized for rocket engine combustion chambers, integrated circuit lead frames, high-load induction coils, and continuous casting mold crystallizers.
PACKAGING: Sealed argon-filled protective bottles or specialized vacuum containment drums.
IMPORTANT NOTICE: This product is highly sensitive to ambient exposure. Keep containers tightly sealed or handle exclusively within an anhydrous inert gas environment to prevent phase contamination or degradation before thermal validation.
TAILORED SOLUTIONS FOR RESEARCH
Contact our engineering team for technical support or official institutional quotations.
EMAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

This powder is highly sensitive to ambient oxygen and moisture, requiring exclusive handling within an anhydrous inert gas environment. Phase contamination or degradation may occur before thermal validation if container seals are compromised.

  • Environmental Sensitivity: Store in sealed argon-filled containers and handle only in inert atmosphere to prevent oxidation.
  • Processing Requirements: The powder is optimized for additive manufacturing and sintering at lower operating temperatures to achieve uniform grain boundary integration.
  • Failure Mode Prevention: Maintain anhydrous conditions to avoid phase contamination that compromises mechanical and thermal conductivity properties.
  • Infrastructure Requirement: Use a glovebox or inert gas enclosure for all powder handling operations.
  • Application Compatibility: Designed for high-temperature components such as rocket engine combustion chambers and induction coils.

What particle size distribution does Atomfair CuCrZr powder offer and how does it affect additive manufacturing consistency?

The powder has a particle size distribution with D10 ≥15 μm, D50 30–40 μm, and D90 ≤60 μm, and a sphericity ≥0.90. This tight distribution and high sphericity ensure consistent layer-to-layer integrity during additive manufacturing, minimizing microstructural variance and improving mechanical reliability in high-temperature components.

For which high-temperature and high-conductivity applications is the Atomfair CuCrZr powder optimized?

This powder is highly optimized for rocket engine combustion chambers, integrated circuit lead frames, high-load induction coils, and continuous casting mold crystallizers. Its thermal conductivity is ≥280 W/(m·K) at room temperature and ≥300 W/(m·K) at 100°C, with an electrical conductivity of ≥85% IACS, making it suitable for demanding thermal and electrical management applications.

What storage and handling precautions are required for Atomfair CuCrZr powder to prevent degradation?

The powder is highly sensitive to ambient exposure. It must be kept in sealed argon-filled protective bottles or specialized vacuum containment drums, and handled exclusively within an anhydrous inert gas environment to prevent phase contamination or degradation before thermal validation. These precautions are critical to maintain the powder's specified purity and performance.

Atomfair CuCrZr spherical alloy powder delivers high thermal conductivity (≥280 W/mK) and electrical conductivity (≥85% IACS) with excellent sphericity (≥0.90) and flowability (≤22 s/50g) for consistent additive manufacturing, but requires strict anhydrous inert gas handling to prevent ambient contamination.

Positive

  • High thermal and electrical conductivity: Thermal conductivity ≥280 W/(m·K) at room temperature and ≥300 W/(m·K) at 100°C, plus electrical conductivity ≥85% IACS, enabling efficient heat dissipation in rocket engine chambers and induction coils.
  • Superior flowability and sphericity: Sphericity ≥0.90 and flowability ≤22 s/50g ensure uniform powder bed packing and layer-to-layer consistency during additive manufacturing, reducing microstructural variance.

Trade-offs

  • Anhydrous inert gas handling required: Product is highly sensitive to ambient exposure; containers must remain sealed under argon or be handled exclusively in an anhydrous inert gas environment to prevent phase contamination or degradation before thermal processing.
  • Narrow particle size distribution: Specified D50 range of 30–40 μm and D90 ≤60 μm tailors the powder for specific powder bed fusion additive processes, potentially limiting its use in other consolidation techniques without modification.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

size

1kg15-53μm, 1kg53-150μm