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Copper Foam Sheet 20 PPI 100 × 200 × 10 mm ATOMFAIR®
Copper Foam Sheet 20 PPI 100 × 200 × 10 mm ATOMFAIR® - Image 2

Copper Foam Sheet 20 PPI 100 × 200 × 10 mm ATOMFAIR®

Price range: $75.00 through $165.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research-grade open-cell copper foam sheet, 20 PPI, 100 × 200 × 10 mm, 50–80% porosity, ≥98% through-pore rate, 1/5 pcs. Order now for lab builds.

SKU: AF-AF-F-C020-T010-BVAR
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Laboratory Open-Cell Copper Foam, 20 PPI, 100 × 200 × 10 mm, 1/5 pcs
Research-grade laboratory product
Product Overview

Open-cell copper foam with 20 PPI provides an interconnected porous-metal structure in a 100 × 200 × 10 mm sheet. Its nominal pore pitch is approximately 1.27 mm, offering a clearly defined cellular specification for laboratory selection and engineering integration.

The material is a foamed copper sheet with a stated porosity of 50–80%, a through-pore rate of at least 98% and a bulk-density range of 0.1–0.8 g/cm³. This combination preserves the continuous open network required for high internal surface exposure while retaining the thermal and electrical characteristics associated with the copper framework.

The open copper network can be evaluated for electrode frameworks and current-collection structures, catalyst-support assemblies, heat-transfer and heat-dissipation components, filtration and water-purification media, acoustic attenuation and electromagnetic-shielding structures, and fluid-pressure buffering devices. Selection should be based on PPI, sheet dimensions, thickness, package quantity and the intended integration method.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-C20-12T10
Material Foamed copper
Product Form Open-cell copper foam sheet
Cell Structure Interconnected open-pore network
Pore Density 20 PPI
Nominal Pore Pitch 1.27 mm
General Pore-Size Capability 0.1–10 mm (5–120 PPI)
Porosity 50–80%
Through-Pore Rate ≥98%
Bulk Density 0.1–0.8 g/cm³
Sheet Size 100 × 200 × 10 mm
Thickness 10 mm
Package Options 1 pcs; 5 pcs
Typical Applications Electrode frameworks, catalyst supports, thermal management, filtration, acoustic attenuation, electromagnetic shielding and fluid-pressure buffering
Key Features and Advantages
  • 20 PPI open-cell structure with an approximately 1.27 mm nominal pore pitch.
  • 100 × 200 mm sheet dimensions with a 10 mm nominal thickness.
  • Interconnected pores with a stated through-pore rate of at least 98%.
  • Stated porosity range of 50–80% and bulk-density range of 0.1–0.8 g/cm³.
  • Copper framework supports thermal-transfer and electrical-conduction applications.
  • High internal surface exposure supports electrode, catalyst-carrier, filtration and acoustic-control evaluations.
  • Available in 1-piece and 5-piece package quantities.
Application Scope

Suitable for laboratory and engineering evaluations that require a 20 PPI open copper network in a 100 × 200 × 10 mm format. Relevant uses include nickel-zinc battery and electric-double-layer-capacitor electrode structures, copper-containing wastewater recovery electrodes, catalyst and photocatalytic air-purification carriers, motor and electronic-component heat-transfer parts, filtration and water-purification media, acoustic attenuation, electromagnetic shielding and pressure-instrument buffering components.
SELECTION GUIDANCE: Confirm PPI, nominal pore pitch, porosity requirement, through-pore rate, sheet length and width, thickness, bulk-density range and required quantity before quotation. Confirm any application-critical pore geometry and integration requirements before ordering.
HANDLING & INSPECTION: Store the sheets in a clean, dry area and protect the open cellular surface from heavy impact, crushing and contamination. After delivery, check the package condition, sheet dimensions and visible pore structure before cutting, bonding or installing the material.
IMPORTANT NOTICE: Custom dimensions are available upon consultation. For a dimensional feasibility review, provide the target length, width, thickness, PPI and estimated quantity.
LABORATORY PROCUREMENT SUPPORT
For PPI selection, sheet-dimension confirmation, package support or application-specific configuration review, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

Store the copper foam sheets in a clean, dry area to prevent contamination and moisture exposure. Protect the open cellular surface from heavy impact, crushing, and mechanical deformation during handling and storage.

  • Storage Environment: Store in a clean, dry area and protect from heavy impact, crushing, and contamination.

How does the porosity range of 50–80% affect the electrical conductivity and mechanical integrity of the copper foam for electrode applications?

The copper foam's electrical conductivity is primarily determined by the continuous copper network, while porosity reduces the effective cross-section for conduction. Higher porosity (closer to 80%) increases internal surface area for electrochemical reactions but lowers bulk density (0.1–0.8 g/cm³) and mechanical strength. The stated through-pore rate of ≥98% ensures that the open network remains interconnected, which is critical for current collection in battery electrodes. Selection should balance surface area requirements against structural needs.

What is the significance of the ≥98% through-pore rate for filtration or catalyst support applications?

The ≥98% through-pore rate indicates that nearly all pores are open and interconnected, minimizing dead-end pores that could trap particles or reduce flow efficiency. For catalyst supports, this ensures maximum exposure of the copper surface to reactants. For filtration, it allows high permeability while maintaining the 20 PPI pore structure with a nominal pore pitch of 1.27 mm. This specification is critical for applications requiring uniform fluid distribution.

What storage and handling precautions are necessary to preserve the open-cell structure of the copper foam?

The copper foam should be stored in a clean, dry area to prevent contamination and oxidation. The open cellular surface must be protected from heavy impact, crushing, and contamination, as mechanical deformation can collapse the pore structure and reduce the effective surface area. Before cutting, bonding, or installing, inspect the sheet dimensions and visible pore structure to ensure integrity. Custom dimensions are available upon consultation.

Open-cell copper foam sheet with 20 PPI, 100×200×10 mm, featuring ≥98% through-pore rate and 50-80% porosity, suitable for electrode, thermal, and filtration applications but requiring careful handling and integration verification.

Positive

  • High Through-Pore Rate: A through-pore rate of ≥98% ensures an interconnected open network, maximizing internal surface exposure for electrode frameworks, catalyst supports, heat transfer, and filtration applications.
  • Adjustable Porosity and Density: The stated porosity range of 50-80% and bulk-density range of 0.1-0.8 g/cm³ allow flexibility in tailoring the material for specific thermal, electrical, or mechanical requirements in laboratory evaluations.

Trade-offs

  • Handling Sensitivity: The open cellular structure must be protected from heavy impact, crushing, and contamination; storage in a clean, dry area is required to preserve pore integrity and performance.
  • Integration Verification Required: Application-critical pore geometry and integration requirements must be confirmed before ordering, as the material is not a plug-and-play solution and may require additional validation for specific engineering uses.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Package Quantity

1 pcs, 5 pcs

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