Copper Foam Sheet 110 PPI 200 × 200 × 5 mm ATOMFAIR®

Price range: $75.00 through $165.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research-grade open-cell copper foam sheet, AF-C110-20T05, 110 PPI, 200 × 200 × 5 mm, 50–80% porosity, ≥98% through-pore rate, 0.23 mm nominal pitch. Order now.

Laboratory Open-Cell Copper Foam, 110 PPI, 200 × 200 × 5 mm, 1/5 pcs
Research-grade laboratory product
Product Overview

Open-cell copper foam with 110 PPI provides an interconnected porous-metal structure in a 200 × 200 × 5 mm sheet. Its nominal pore pitch is approximately 0.23 mm, offering a clearly defined cellular specification for laboratory selection and engineering integration.

The material is a foamed copper sheet with a stated porosity of 50–80%, a through-pore rate of at least 98% and a bulk-density range of 0.1–0.8 g/cm³. This combination preserves the continuous open network required for high internal surface exposure while retaining the thermal and electrical characteristics associated with the copper framework.

The open copper network can be evaluated for electrode frameworks and current-collection structures, catalyst-support assemblies, heat-transfer and heat-dissipation components, filtration and water-purification media, acoustic attenuation and electromagnetic-shielding structures, and fluid-pressure buffering devices. Selection should be based on PPI, sheet dimensions, thickness, package quantity and the intended integration method.

Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-C110-20T05
Material Foamed copper
Product Form Open-cell copper foam sheet
Cell Structure Interconnected open-pore network
Pore Density 110 PPI
Nominal Pore Pitch 0.23 mm
General Pore-Size Capability 0.1–10 mm (5–120 PPI)
Porosity 50–80%
Through-Pore Rate ≥98%
Bulk Density 0.1–0.8 g/cm³
Sheet Size 200 × 200 × 5 mm
Thickness 5 mm
Package Options 1 pcs; 5 pcs
Typical Applications Electrode frameworks, catalyst supports, thermal management, filtration, acoustic attenuation, electromagnetic shielding and fluid-pressure buffering
Key Features and Advantages
  • 110 PPI open-cell structure with an approximately 0.23 mm nominal pore pitch.
  • 200 × 200 mm sheet dimensions with a 5 mm nominal thickness.
  • Interconnected pores with a stated through-pore rate of at least 98%.
  • Stated porosity range of 50–80% and bulk-density range of 0.1–0.8 g/cm³.
  • Copper framework supports thermal-transfer and electrical-conduction applications.
  • High internal surface exposure supports electrode, catalyst-carrier, filtration and acoustic-control evaluations.
  • Available in 1-piece and 5-piece package quantities.
Application Scope

Suitable for laboratory and engineering evaluations that require a 110 PPI open copper network in a 200 × 200 × 5 mm format. Relevant uses include nickel-zinc battery and electric-double-layer-capacitor electrode structures, copper-containing wastewater recovery electrodes, catalyst and photocatalytic air-purification carriers, motor and electronic-component heat-transfer parts, filtration and water-purification media, acoustic attenuation, electromagnetic shielding and pressure-instrument buffering components.

SELECTION GUIDANCE: Confirm PPI, nominal pore pitch, porosity requirement, through-pore rate, sheet length and width, thickness, bulk-density range and required quantity before quotation. Confirm any application-critical pore geometry and integration requirements before ordering.
HANDLING & INSPECTION: Store the sheets in a clean, dry area and protect the open cellular surface from heavy impact, crushing and contamination. After delivery, check the package condition, sheet dimensions and visible pore structure before cutting, bonding or installing the material.
IMPORTANT NOTICE: Custom dimensions are available upon consultation. For a dimensional feasibility review, provide the target length, width, thickness, PPI and estimated quantity.
LABORATORY PROCUREMENT SUPPORT
For PPI selection, sheet-dimension confirmation, package support or application-specific configuration review, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

Store the copper foam sheets in a clean, dry area to prevent contamination and oxidation of the high-surface-area copper network. Protect the open cellular structure from heavy impact, crushing, and physical deformation that can collapse the pore architecture.

  • Storage and Environmental Constraint: Store sheets in a clean, dry environment to avoid pore blockage by dust or debris and to minimize surface oxidation of the copper framework.
  • Mechanical Protection Constraint: Protect the open-cell structure from heavy impact or crushing forces that would permanently collapse the interconnected pore network and reduce through-pore rate.
  • Contamination Prevention Constraint: Prevent contact with oils, greases, or corrosive chemicals that can contaminate the high-surface-area copper and degrade performance in electrode or catalyst applications.

Inspect the copper foam sheet immediately after delivery to verify dimensional conformance and structural integrity before integration. Handle the sheet with care to preserve the open-pore network for its intended application.

Required Equipment: Clean, lint-free gloves, Clean, flat inspection surface

  1. Inspect packaging and sheet condition
    Examine the outer package for signs of crushing or damage, then open it on a clean, flat surface.
  2. Verify sheet dimensions
    Measure the sheet length, width, and thickness with a calibrated ruler or caliper to confirm they match the 200 × 200 × 5 mm specification.
  3. Visually assess pore structure
    Inspect the open-cell network under adequate lighting to confirm a uniform pore distribution and the absence of visible crushed or blocked regions.
  4. Handle and store the sheet
    Transfer the sheet to its storage location using clean gloves, placing it on a flat, dry surface away from potential impact sources.

How does the 110 PPI pore density of this copper foam affect its suitability for electrode versus filtration applications?

The 110 PPI (0.23 mm nominal pore pitch) copper foam provides a high surface area open network ideal for electrode frameworks and catalyst supports, where high internal surface exposure is critical. For filtration applications, the ≥98% through-pore rate and 50–80% porosity ensure low flow resistance, but the 0.23 mm pore pitch means it is best suited for fine particulate filtration. The trade-off between pore density and fluid permeability should be evaluated against the specific application's pore size and pressure drop requirements.

What integration considerations are important when using this copper foam as a current collector in nickel-zinc batteries?

When integrating this 110 PPI copper foam as a current collector for nickel-zinc battery electrodes, the bulk density range of 0.1–0.8 g/cm³ and the copper framework's support for electrical-conduction applications enable efficient current collection. The interconnected open pore network with ≥98% through-pore rate facilitates electrolyte penetration and active material loading. The selection guidance advises confirming pore geometry and integration requirements before ordering, as the 5 mm thickness and 200×200 mm sheet size may need custom cutting or shaping.

What are the recommended storage and handling procedures for this copper foam sheet to maintain its structural integrity?

Store the copper foam sheets in a clean, dry area and protect the open cellular surface from heavy impact, crushing, and contamination. After delivery, inspect the package condition, sheet dimensions, and visible pore structure before cutting, bonding, or installing the material. These precautions preserve the 110 PPI open-cell structure and ≥98% through-pore rate for reliable laboratory evaluations.

This 110 PPI open-cell copper foam sheet (200 × 200 × 5 mm) provides a high through-pore rate (≥98%) and a porosity range of 50–80%, making it suitable for electrode frameworks, catalyst supports, and thermal management applications where interconnected porosity and copper's electrical/thermal conductivity are required.

Positive

  • High through-pore rate for fluid access: With a through-pore rate of at least 98%, the open-cell structure ensures nearly all pores are interconnected, maximizing internal surface exposure for electrode, catalyst, or filtration applications.
  • Copper framework supports thermal and electrical use: The copper matrix provides inherent thermal and electrical conductivity, enabling evaluation in heat-transfer components, current-collection structures, and electromagnetic shielding without additional conductive coatings.

Trade-offs

  • Mechanical fragility from open-cell structure: The open-cell foam is susceptible to crushing or deformation under heavy impact or compressive loads, requiring careful handling and storage in a clean, dry area to preserve pore geometry.
  • Porosity variability requires application-specific validation: The stated porosity range of 50–80% and bulk-density range of 0.1–0.8 g/cm³ indicate batch-to-batch variation; users must confirm pore geometry and density against application-critical requirements before integration.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Package Quantity

1 pcs, 5 pcs

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