Atomfair Beta Silicon Carbide Fine Abrasive Powder (3C-SiC), D50 0.37 μm
Product Description
Atomfair Beta Silicon Carbide Fine Abrasive Powder (3C-SiC) is supplied with a D50 0.37 μm particle-size specification and high natural bulk density. It is intended for precision grinding, lapping, polishing, and abrasive-processing research.
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Technical Specifications
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Customization & Ordering
Custom particle-size and purity requirements may be evaluated for selected
grades upon request. Alternative package sizes may also be available.
Minimum order quantities, pricing, and lead times vary by specification and
will be confirmed during technical review and quotation.
Key Features and Advantages
- Defined D50 0.37 μm particle-size grade.
- High natural bulk density and efficient abrasive-cutting behavior.
- Lower processed-surface roughness and improved surface-finish performance.
- Suitable for controlled grinding, lapping, and polishing evaluation.
APPLICATION SCOPE: precision grinding, lapping, polishing, and abrasive-processing research
DOCUMENTATION: COA and SDS can be provided upon request for batch-specific confirmation. Additional documentation requirements may be discussed before order confirmation.
LABORATORY PROCUREMENT SUPPORT
For grade selection, particle-size confirmation, documentation support or custom specification review, contact our technical sales team.
This powder requires controlled storage to prevent moisture absorption and particle agglomeration. The material's high surface area and fine particle size necessitate careful handling to avoid airborne dust generation and cross-contamination.
- Moisture Sensitivity: Store in a sealed, dry container to prevent moisture-induced agglomeration that alters particle size distribution.
- Contamination Control: Use dedicated, clean utensils and containers to avoid introducing foreign particles that compromise abrasive performance.
- Dust Management: Handle in a well-ventilated area or fume hood to minimize inhalation of respirable fine dust.
This procedure outlines the preparation of a stable abrasive slurry and its application for controlled lapping on a flat plate. Proper dispersion and consistent application are critical to achieving uniform material removal and target surface finish.
Required Equipment: Lapping plate (e.g., cast iron or glass), Slurry mixing container and stirrer, Precision balance, Personal protective equipment (gloves, safety glasses, dust mask)
- Weigh powder
Weigh the required amount of Atomfair Beta Silicon Carbide powder using a precision balance in a clean, dry environment. - Prepare slurry
Mix the weighed powder with a compatible carrier fluid (e.g., deionized water or lapping oil) at a recommended concentration of 5-15% by weight, stirring until a uniform suspension is achieved. - Apply slurry to plate
Apply a small, even amount of the prepared slurry onto the lapping plate surface, spreading it uniformly across the working area. - Position workpiece
Place the workpiece onto the slurry-coated lapping plate, ensuring full contact between the workpiece surface and the abrasive medium. - Execute lapping cycle
Move the workpiece in a figure-eight or oscillatory pattern across the plate under controlled pressure and speed for the desired processing time. - Clean workpiece
Remove the workpiece from the plate and thoroughly rinse with deionized water or solvent to remove residual abrasive particles. - Inspect surface
Inspect the processed surface under a microscope or profilometer to verify that the target roughness and flatness specifications are met.
How does the narrow particle size distribution of Atomfair Beta SiC powder (D50 0.37 μm, D97 ≤0.9 μm) influence surface roughness compared to broader distributions?
The narrow distribution (D10=0.08 μm, D90=0.72 μm) ensures a consistent cut depth, reducing surface roughness and improving finish quality. The D97 ≤0.9 μm guarantees minimal oversized particles that could cause scratches, supporting the product's claim of lower processed-surface roughness and improved surface-finish performance.
What are the key considerations when using Atomfair 3C-SiC abrasive powder for lapping semiconductor materials?
The cubic beta-SiC (3C-SiC) phase offers high hardness suitable for silicon and compound semiconductors. The ultrafine D50 of 0.37 μm is ideal for final polishing steps. However, the basic grain content of 60–80% means the abrasive includes some non-optimal particles; for critical applications, custom particle-size and purity grades may be evaluated upon request, as stated in the product description.
What storage and handling conditions are recommended for Atomfair Beta SiC powder to maintain its particle size distribution and performance?
The powder should be stored in a dry, sealed container to prevent moisture absorption and agglomeration, which could alter the D50. The high tap density (0.70 ± 0.1 g/cm³) reduces dusting during handling, but proper PPE (respiratory protection, gloves, goggles) is advised for fine powders. The SDS, available upon request, provides detailed environmental controls and handling precautions.
Evaluation of Atomfair Beta Silicon Carbide Fine Abrasive Powder (3C-SiC) with D50 0.37 μm for precision grinding, lapping, and polishing. The product offers a defined particle size distribution and high tap density, but the basic grain content range and particle size tail require careful process validation.
Positive
- Defined D50 particle size grade: D50 of 0.37 μm with D97 ≤0.9 μm provides a controlled particle size distribution for consistent abrasive action in fine finishing applications.
- High tap density and cubic phase: Tap density of 0.70 ± 0.1 g/cm³ combined with cubic beta-SiC phase contributes to efficient cutting behavior and reduced processed-surface roughness.
Trade-offs
- Basic grain content range: Basic grain content of 60-80% indicates a non-uniform fraction that may require batch-specific verification to maintain consistent abrasive performance.
- Particle size distribution tail: D97 ≤0.9 μm shows a tail in the distribution, which could limit uniformity in ultra-fine polishing or lapping processes requiring narrower size cutoffs.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
