Atomfair Hexagonal Boron Nitride (h-BN) Powder, Nanoscale Powder, D50 50 nm
Product Description
Atomfair hexagonal boron nitride (h-BN) powder is supplied as nanoscale granular particles, with a D50 particle size of 50 nm and a specific surface area of 100 m²/g. It is intended for ultrathin thermally conductive film and composite boron nitride ceramic research.
Technical Specifications
| PARAMETER DETAILS | |
|---|---|
| Product | Hexagonal Boron Nitride (h-BN) Powder |
| Chemical Formula | BN |
| Structure / Phase | Hexagonal boron nitride (h-BN) |
| Morphology | Nanoscale granular particles |
| D50 Particle Size | 50 nm |
| Specific Surface Area | 100 m2/g |
| Tap Density | 0.4 g/cm3 |
| Water-Soluble Boron | 0.10% |
Customization & Ordering
Custom specifications, quantities, or packaging may be available upon request. Please submit your target specifications, required quantity, packaging requirements, and delivery timeline through Request a Quote.
Key Features and Advantages
- Morphology: Nanoscale granular particles.
- Specified D50 particle size: 50 nm.
- Specified specific surface area: 100 m²/g.
APPLICATION SCOPE: ultrathin thermally conductive film and composite boron nitride ceramic research.
DOCUMENTATION: COA and SDS can be provided upon request for batch-specific confirmation.
TAILORED SOLUTIONS FOR RESEARCH
Contact our engineering team for technical support or official institutional quotations.
What is the thermal conductivity trade-off when using 50 nm h-BN powder versus larger particle sizes for ultrathin thermally conductive films?
The 50 nm D50 particle size and 100 m²/g specific surface area of this h-BN powder maximize filler-matrix interfacial area, which can enhance phonon transfer in ultrathin films but may increase thermal boundary resistance compared to larger, more crystalline h-BN platelets. This trade-off is critical for achieving uniform thermal conductivity in sub-micron film thicknesses, as the nanoscale granular morphology reduces percolation threshold effects while potentially limiting bulk thermal conductivity.
Can this nanoscale h-BN powder be directly integrated into polymer or ceramic composite formulations without additional surface treatment?
Yes, the powder is supplied as dry nanoscale granular particles with a tap density of 0.4 g/cm³ and water-soluble boron content below 0.10%, making it suitable for direct dispersion in organic solvents or resin systems for composite boron nitride ceramic research. However, the high specific surface area of 100 m²/g may require optimized dispersion protocols to prevent agglomeration in viscous polymer matrices.
What handling and storage precautions are required for 50 nm h-BN powder to maintain its nanoscale properties?
The nanoscale granular particles with D50 of 50 nm and high specific surface area of 100 m²/g are prone to electrostatic charging and moisture adsorption, so storage in sealed, dry containers under inert atmosphere is recommended. A Safety Data Sheet (SDS) is available upon request for batch-specific handling guidelines, and the low tap density of 0.4 g/cm³ indicates the powder is highly aeratable, requiring fume hood use during transfer to avoid inhalation.
Atomfair hexagonal boron nitride (h-BN) powder with D50 50 nm and specific surface area 100 m²/g is evaluated for ultrathin thermally conductive film and composite boron nitride ceramic research, with nanoscale granular morphology enabling high interface density.
Positive
- Nanoscale granular morphology: The specified D50 of 50 nm with granular particle shape provides high surface-to-volume ratio, facilitating dispersion and uniform film formation for ultrathin thermally conductive layers.
- High specific surface area: A specific surface area of 100 m²/g enhances interfacial contact in composite matrices, potentially improving thermal and mechanical coupling in boron nitride ceramic systems.
Trade-offs
- Low tap density handling: Tap density of 0.4 g/cm³ indicates a fluffy, low-bulk-density powder requiring careful compaction and handling procedures to avoid dust generation and achieve consistent packing in composites.
- Measurable water-soluble boron: Water-soluble boron content at 0.10% may leach into aqueous or humid environments, potentially affecting purity-sensitive applications or requiring additional purification steps.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
