Atomfair Hexagonal Boron Nitride (h-BN) Powder, Fine Particle Size, D50 4 μm
Product Description
Atomfair hexagonal boron nitride (h-BN) powder is supplied as small, thin circular platelets with weak agglomeration, with a D50 particle size of 4 μm and medium crystallinity. It is intended for composite-ceramic and coating research.
Technical Specifications
| PARAMETER DETAILS | |
|---|---|
| Product | Hexagonal Boron Nitride (h-BN) Powder |
| Chemical Formula | BN |
| Structure / Phase | Hexagonal boron nitride (h-BN) |
| Morphology | Small, thin circular platelets with weak agglomeration |
| Crystallinity | Medium |
| D50 Particle Size | 4 μm |
| Specific Surface Area | 12 m2/g |
| Tap Density | 0.4 g/cm3 |
| Water-Soluble Boron | 0.10% |
Customization & Ordering
Custom specifications, quantities, or packaging may be available upon request. Please submit your target specifications, required quantity, packaging requirements, and delivery timeline through Request a Quote.
Key Features and Advantages
- Morphology: Small, thin circular platelets with weak agglomeration.
- Specified D50 particle size: 4 μm.
- Specified specific surface area: 12 m²/g.
APPLICATION SCOPE: composite-ceramic and coating research.
DOCUMENTATION: COA and SDS can be provided upon request for batch-specific confirmation.
TAILORED SOLUTIONS FOR RESEARCH
Contact our engineering team for technical support or official institutional quotations.
How do the D50 particle size of 4 μm and specific surface area of 12 m²/g influence the performance of this h-BN powder in composite and coating research?
The specified D50 of 4 μm and specific surface area of 12 m²/g provide a fine, high-surface-area powder that promotes uniform dispersion and strong interfacial interactions in composite-ceramic and coating matrices. The small, thin circular platelets with weak agglomeration further enhance mixing and packing behavior, while the medium crystallinity balances thermal conductivity and mechanical properties for research applications.
What material characteristics make this h-BN powder suitable for composite-ceramic and coating applications?
This h-BN powder is specifically designed for composite-ceramic and coating research, featuring small, thin circular platelets with weak agglomeration and a D50 of 4 μm. The low water-soluble boron content of 0.10% minimizes potential ionic contamination, and the specified specific surface area of 12 m²/g supports effective matrix bonding and filler distribution in ceramic and coating formulations.
What safety, handling, and documentation provisions are available for this h-BN powder?
Batch-specific COA and SDS documentation can be provided upon request to support safe handling and compliance, as stated in the product description. Standard powder handling precautions should be followed to avoid inhalation or skin contact, and the material should be stored in dry conditions to preserve its specified properties such as tap density of 0.4 g/cm³ and water-soluble boron content.
Atomfair h-BN powder (D50 4 μm) offers a well-defined platelet morphology with weak agglomeration and a specified surface area of 12 m²/g, making it suitable for composite-ceramic and coating research, though its medium crystallinity and relatively high water-soluble boron content present trade-offs for applications demanding maximum thermal performance or high purity.
Positive
- Controlled fine particle size: The D50 of 4 μm provides consistent particle dimensions for uniform dispersion in composite matrices and coating formulations, reducing variability in lab-scale processing.
- Weak agglomeration and platelet shape: Thin circular platelets with weak agglomeration facilitate easier deagglomeration and alignment during mixing, which can improve filler distribution and potentially enhance barrier or thermal properties in composites.
Trade-offs
- Medium crystallinity limits thermal performance: The medium crystallinity implies a higher degree of lattice defects compared to high-crystallinity h-BN, which can reduce thermal conductivity and phonon transport efficiency in heat-management applications.
- Low tap density and soluble boron content: A tap density of 0.4 g/cm³ indicates poor packing and potential dusting during handling, while the 0.10% water-soluble boron may pose contamination risks in ultra-pure or electronic-grade processes.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
