Atomfair Hexagonal Boron Nitride (h-BN) Powder, Thin-Platelet Morphology, D50 10 μm
Product Description
Atomfair hexagonal boron nitride (h-BN) powder is supplied as thin, rounded single platelets, with a D50 particle size of 10 μm and high crystallinity. It is intended for thermally conductive formulations and aluminum-extrusion processing research.
Technical Specifications
| PARAMETER DETAILS | |
|---|---|
| Product | Hexagonal Boron Nitride (h-BN) Powder |
| Chemical Formula | BN |
| Structure / Phase | Hexagonal boron nitride (h-BN) |
| Morphology | Thin, rounded single platelets |
| Crystallinity | High |
| D50 Particle Size | 10 μm |
| Specific Surface Area | 7 m2/g |
| Tap Density | 0.5 g/cm3 |
| Water-Soluble Boron | 0.08% |
Customization & Ordering
Custom specifications, quantities, or packaging may be available upon request. Please submit your target specifications, required quantity, packaging requirements, and delivery timeline through Request a Quote.
Key Features and Advantages
- Morphology: Thin, rounded single platelets.
- Specified D50 particle size: 10 μm.
- Specified specific surface area: 7 m²/g.
APPLICATION SCOPE: thermally conductive formulations and aluminum-extrusion processing research.
DOCUMENTATION: COA and SDS can be provided upon request for batch-specific confirmation.
TAILORED SOLUTIONS FOR RESEARCH
Contact our engineering team for technical support or official institutional quotations.
How does the D50 particle size and specific surface area of Atomfair h-BN powder affect its performance in thermally conductive formulations?
The D50 particle size of 10 μm and specific surface area of 7 m²/g are specified to balance packing density and thermal pathway formation. The thin, rounded single-platelet morphology promotes efficient particle-to-particle contact, while the high crystallinity and low water-soluble boron content (0.08%) ensure minimal impurity interference in thermally conductive resin or coating systems.
What are the application constraints of Atomfair h-BN powder in aluminum-extrusion processing research?
This h-BN powder is intentionally designed for aluminum-extrusion processing research, where its thin platelet morphology and controlled D50 of 10 μm act as a solid lubricant or release agent. The low water-soluble boron content (0.08%) is critical to avoid boron contamination in the extrusion environment. It is not intended for consumer or food-contact applications, and users must confirm compatibility with their specific process conditions.
What handling and storage considerations are required for Atomfair h-BN powder?
As a fine powder with a tap density of 0.5 g/cm³, Atomfair h-BN is light and prone to dusting, so it should be handled in a fume hood or with appropriate dust control. The COA and SDS are available upon request to provide batch-specific safety and handling data. No strict storage temperature is specified, but keeping the powder in a sealed, dry container is recommended to prevent moisture pick-up or contamination.
The Atomfair h-BN powder, characterized by thin rounded platelet morphology, D50 10 μm, high crystallinity, specific surface area 7 m²/g, and low water-soluble boron, is evaluated for its application in thermally conductive formulations and aluminum-extrusion processing research.
Positive
- Thin platelet morphology with high crystallinity: The thin, rounded single platelets with a D50 of 10 μm and high crystallinity provide a well-defined geometry that supports uniform filler distribution and thermal percolation in composite formulations.
- Low water-soluble boron content: With only 0.08% water-soluble boron, the powder reduces ionic contamination risk, which is beneficial for aluminum-extrusion research where boron can affect alloy behavior.
Trade-offs
- Low tap density: A tap density of 0.5 g/cm³ means the powder occupies a larger volume per gram, requiring greater storage space and careful volumetric measurement during batching.
- Specific surface area of 7 m²/g: The relatively high specific surface area may promote moisture adsorption and particle agglomeration, necessitating dry storage and proper dispersion techniques in processing.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
