Atomfair Hexagonal Boron Nitride (h-BN) Powder, Large-Platelet Morphology, D50 55 μm
Product Description
Atomfair hexagonal boron nitride (h-BN) powder is supplied as large, thin single platelets with smooth surfaces and low agglomeration, with a D50 particle size of 55 μm and high crystallinity. It is intended for thermally conductive plastic formulations, related components, and thermal-interface-material research.
Technical Specifications
| PARAMETER DETAILS | |
|---|---|
| Product | Hexagonal Boron Nitride (h-BN) Powder |
| Chemical Formula | BN |
| Structure / Phase | Hexagonal boron nitride (h-BN) |
| Morphology | Large, thin single platelets with smooth surfaces and low agglomeration |
| Crystallinity | High |
| D50 Particle Size | 55 μm |
| Specific Surface Area | 0.5 m2/g |
| Tap Density | 0.4 g/cm3 |
| Water-Soluble Boron | 0.06% |
Customization & Ordering
Custom specifications, quantities, or packaging may be available upon request. Please submit your target specifications, required quantity, packaging requirements, and delivery timeline through Request a Quote.
Key Features and Advantages
- Morphology: Large, thin single platelets with smooth surfaces and low agglomeration.
- Specified D50 particle size: 55 μm.
- Specified specific surface area: 0.5 m²/g.
APPLICATION SCOPE: thermally conductive plastic formulations, related components, and thermal-interface-material research.
DOCUMENTATION: COA and SDS can be provided upon request for batch-specific confirmation.
TAILORED SOLUTIONS FOR RESEARCH
Contact our engineering team for technical support or official institutional quotations.
How does the D50 particle size of 55 μm influence the thermal conductivity of this h-BN powder in polymer composites?
The D50 particle size of 55 μm indicates large, thin platelets designed to minimize interfacial thermal resistance in polymer matrices. Combined with a specific surface area of 0.5 m²/g and high crystallinity, this morphology supports efficient thermal percolation for thermally conductive plastic formulations and thermal-interface-material research.
What is the significance of the specific surface area (0.5 m²/g) for the performance of this h-BN powder?
The specific surface area of 0.5 m²/g reflects the large platelet size and smooth surface morphology, which reduces the amount of polymer matrix needed to wet the filler particles. This low surface area can contribute to higher filler loadings and improved thermal conductivity in composite applications.
How does the water-soluble boron content (0.06%) affect the handling or application of this h-BN powder?
The water-soluble boron content is specified at 0.06%, indicating a low level of leachable boron species. This is particularly important for thermal interface materials where ionic impurities can affect electrical insulation or cause corrosion, and it also simplifies handling by reducing the risk of contamination during processing.
Atomfair h-BN powder with large-platelet morphology (D50 55 μm, 0.5 m²/g specific surface area) offers high crystallinity and low agglomeration, making it suitable for thermally conductive plastic formulations and thermal interface materials.
Positive
- Large thin platelet morphology with low agglomeration: The powder consists of large, thin single platelets with smooth surfaces and low agglomeration, facilitating uniform dispersion in polymer matrices.
- High crystallinity and specified D50 particle size: High crystallinity and a D50 particle size of 55 μm provide consistent thermal conductivity performance in composite formulations.
Trade-offs
- Water-soluble boron content of 0.06%: The powder contains 0.06% water-soluble boron, which may be a concern for applications requiring extremely low ionic contamination levels.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
