Atomfair Hexagonal Boron Nitride (h-BN) Powder, Large-Platelet Morphology, D50 45 μm
Product Description
Atomfair hexagonal boron nitride (h-BN) powder is supplied as large, thin single platelets with smooth surfaces and low agglomeration, with a D50 particle size of 45 μm and high crystallinity. It is intended for thermally conductive plastic formulations, related components, and thermal-interface-material research.
Technical Specifications
| PARAMETER DETAILS | |
|---|---|
| Product | Hexagonal Boron Nitride (h-BN) Powder |
| Chemical Formula | BN |
| Structure / Phase | Hexagonal boron nitride (h-BN) |
| Morphology | Large, thin single platelets with smooth surfaces and low agglomeration |
| Crystallinity | High |
| D50 Particle Size | 45 μm |
| Specific Surface Area | 0.5 m2/g |
| Tap Density | 0.4 g/cm3 |
| Water-Soluble Boron | 0.06% |
Customization & Ordering
Custom specifications, quantities, or packaging may be available upon request. Please submit your target specifications, required quantity, packaging requirements, and delivery timeline through Request a Quote.
Key Features and Advantages
- Morphology: Large, thin single platelets with smooth surfaces and low agglomeration.
- Specified D50 particle size: 45 μm.
- Specified specific surface area: 0.5 m²/g.
APPLICATION SCOPE: thermally conductive plastic formulations, related components, and thermal-interface-material research.
DOCUMENTATION: COA and SDS can be provided upon request for batch-specific confirmation.
TAILORED SOLUTIONS FOR RESEARCH
Contact our engineering team for technical support or official institutional quotations.
How does the large-platelet morphology and low specific surface area of this h-BN powder contribute to thermal conductivity in polymer composites?
The large, thin single platelets with smooth surfaces and low agglomeration maximize filler contact area and minimize phonon scattering at interfaces. The low specific surface area (0.5 m²/g) indicates minimal surface defects and high crystallinity, further reducing thermal resistance. These properties make this powder suitable for thermally conductive plastic formulations and thermal interface materials.
What is the significance of the low water-soluble boron content (0.06%) in this h-BN powder for electronic applications?
The water-soluble boron content of 0.06% is a measure of ionic impurities. This low value is desirable for applications requiring high electrical resistivity and long-term stability, such as thermal interface materials in electronics, as it minimizes potential contamination of surrounding components.
What specific applications is this h-BN powder with D50 45 μm designed for?
This powder is specifically designed for thermally conductive plastic formulations, related components, and thermal-interface-material research. The large-platelet morphology, high crystallinity, and low agglomeration are intended to achieve high thermal conductivity in these applications.
Atomfair h-BN powder with large-platelet morphology and D50 45 μm offers high crystallinity and low agglomeration for thermally conductive plastic and TIM research, but requires careful handling due to low tap density and water-soluble boron content.
Positive
- Large-platelet morphology with low agglomeration: The large, thin single platelets with smooth surfaces and low agglomeration enhance particle packing and thermal percolation in polymer matrices, improving thermal conductivity in composite formulations.
- High crystallinity and specified D50 45 μm: High crystallinity ensures efficient phonon transport, while the specified D50 particle size of 45 μm provides consistent filler loading and predictable thermal performance in thermal-interface-material research.
Trade-offs
- Low tap density requires volume management: With a tap density of 0.4 g/cm³, the powder occupies significant volume per mass, necessitating careful handling and compounding adjustments to avoid segregation or air entrapment during processing.
- Water-soluble boron content limits wet processing: The 0.06% water-soluble boron content may leach into aqueous environments during wet mixing or cleaning, potentially affecting formulation purity or requiring controlled processing conditions.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
