Atomfair Hexagonal Boron Nitride (h-BN) Powder, Large-Platelet Morphology, D50 30 μm
Product Description
Atomfair hexagonal boron nitride (h-BN) powder is supplied as large, thin single platelets with smooth surfaces and low agglomeration, with a D50 particle size of 30 μm and high crystallinity. It is intended for thermally conductive plastic formulations, related components, and thermal-interface-material research.
Technical Specifications
| PARAMETER DETAILS | |
|---|---|
| Product | Hexagonal Boron Nitride (h-BN) Powder |
| Chemical Formula | BN |
| Structure / Phase | Hexagonal boron nitride (h-BN) |
| Morphology | Large, thin single platelets with smooth surfaces and low agglomeration |
| Crystallinity | High |
| D50 Particle Size | 30 μm |
| Specific Surface Area | 1.0 m2/g |
| Tap Density | 0.6 g/cm3 |
| Water-Soluble Boron | 0.08% |
Customization & Ordering
Custom specifications, quantities, or packaging may be available upon request. Please submit your target specifications, required quantity, packaging requirements, and delivery timeline through Request a Quote.
Key Features and Advantages
- Morphology: Large, thin single platelets with smooth surfaces and low agglomeration.
- Specified D50 particle size: 30 μm.
- Specified specific surface area: 1.0 m²/g.
APPLICATION SCOPE: thermally conductive plastic formulations, related components, and thermal-interface-material research.
DOCUMENTATION: COA and SDS can be provided upon request for batch-specific confirmation.
TAILORED SOLUTIONS FOR RESEARCH
Contact our engineering team for technical support or official institutional quotations.
How does the large-platelet morphology and low specific surface area of this h-BN powder affect its thermal conductivity performance in polymer composites?
The large, thin single platelets with smooth surfaces and low agglomeration minimize phonon scattering and interfacial thermal resistance, enhancing thermal conductivity. The low specific surface area of 1.0 m²/g and high crystallinity further support efficient phonon transport. The tap density of 0.6 g/cm³ allows for high filler loading, improving overall composite thermal conductivity.
Can this h-BN powder be used in applications requiring both thermal management and electrical insulation?
Yes, hexagonal boron nitride is inherently electrically insulating while being thermally conductive. The water-soluble boron content of only 0.08% indicates high purity, reducing ionic contamination that could degrade electrical insulation. This makes the powder suitable for thermally conductive plastic formulations and thermal-interface-material research requiring electrical insulation.
What storage and handling conditions are recommended to preserve the platelet morphology of this h-BN powder?
Store in a dry environment to prevent moisture-induced agglomeration, as the powder has low agglomeration as supplied. Avoid high-shear mixing or milling that could fracture the large, thin platelets. Use gentle blending techniques. Follow standard safety precautions per the SDS, and use appropriate PPE.
Atomfair h-BN powder with large platelet morphology and D50 30 μm offers high crystallinity and low agglomeration for thermally conductive polymer research, but its low tap density and water-soluble boron content introduce handling and purity considerations.
Positive
- Large platelet morphology with low agglomeration: The large, thin single platelets with smooth surfaces facilitate efficient heat transfer pathways in thermally conductive plastics and thermal interface materials, improving filler network formation.
- High crystallinity and controlled surface area: High crystallinity combined with a specified specific surface area of 1.0 m²/g ensures consistent thermal and mechanical behavior in composite formulations, reducing batch-to-batch variability.
Trade-offs
- Low tap density requires careful handling: With a tap density of 0.6 g/cm³, the powder occupies a large volume per mass, requiring controlled dispensing and dust mitigation measures during weighing and mixing operations.
- Water-soluble boron content may affect purity: The 0.08% water-soluble boron fraction could leach under humid or aqueous conditions, potentially contaminating formulations that require strict ionic purity or moisture resistance.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
