Atomfair Hexagonal Boron Nitride (h-BN) Powder, Large-Platelet Morphology, D50 20 μm
Product Description
Atomfair hexagonal boron nitride (h-BN) powder is supplied as large, thin single platelets with smooth surfaces and low agglomeration, with a D50 particle size of 20 μm and high crystallinity. It is intended for thermally conductive plastic formulations, related components, and cosmetic research.
Technical Specifications
| PARAMETER DETAILS | |
|---|---|
| Product | Hexagonal Boron Nitride (h-BN) Powder |
| Chemical Formula | BN |
| Structure / Phase | Hexagonal boron nitride (h-BN) |
| Morphology | Large, thin single platelets with smooth surfaces and low agglomeration |
| Crystallinity | High |
| D50 Particle Size | 20 μm |
| Specific Surface Area | 1.5 m2/g |
| Tap Density | 0.6 g/cm3 |
| Water-Soluble Boron | 0.08% |
Customization & Ordering
Custom specifications, quantities, or packaging may be available upon request. Please submit your target specifications, required quantity, packaging requirements, and delivery timeline through Request a Quote.
Key Features and Advantages
- Morphology: Large, thin single platelets with smooth surfaces and low agglomeration.
- Specified D50 particle size: 20 μm.
- Specified specific surface area: 1.5 m²/g.
APPLICATION SCOPE: thermally conductive plastic formulations, related components, and cosmetic research.
DOCUMENTATION: COA and SDS can be provided upon request for batch-specific confirmation.
TAILORED SOLUTIONS FOR RESEARCH
Contact our engineering team for technical support or official institutional quotations.
How does the large-platelet morphology and D50 of 20 μm in Atomfair h-BN powder affect thermal conductivity in polymer composites?
The large, thin single platelets with smooth surfaces and low agglomeration maximize particle-to-particle contact and reduce interfacial thermal resistance in polymer matrices. The D50 of 20 μm and high crystallinity further enhance phonon transport efficiency, making this grade specifically designed for thermally conductive plastic formulations. The low specific surface area of 1.5 m²/g also minimizes polymer wetting issues during compounding.
What are the purity and handling constraints for Atomfair h-BN powder with 0.08% water-soluble boron?
The water-soluble boron content is specified at 0.08%, which is critical for applications requiring low ionic contamination, such as electronic encapsulation or cosmetic formulations. This parameter indicates the fraction of boron that can leach into aqueous environments, potentially affecting dielectric properties or biological compatibility. Standard handling precautions for fine powders apply, and batch-specific COA and SDS are available upon request.
Can Atomfair h-BN powder with a tap density of 0.6 g/cm³ be directly incorporated into injection-molded thermoplastic compounds?
Yes, the low tap density of 0.6 g/cm³ and low agglomeration morphology facilitate uniform dispersion in polymer melts without excessive shear or pre-compaction steps. The large platelet geometry and smooth surfaces reduce filler settling during molding, which is advantageous for maintaining consistent thermal conductivity in injection-molded parts. However, compatibility with specific resin systems should be verified through small-scale trials.
Atomfair hexagonal boron nitride powder with large-platelet morphology (D50 20 μm) provides high crystallinity and low agglomeration, advantageous for thermally conductive plastic formulations. The specified tap density of 0.6 g/cm³ and water-soluble boron content of 0.08% are operational parameters that influence powder handling and application compatibility.
Positive
- Large platelet morphology: Large, thin single platelets with smooth surfaces and low agglomeration enhance thermal conductivity percolation paths in polymer matrices, reducing filler loading requirements.
- High crystallinity and controlled D50: Specified D50 of 20 μm and high crystallinity ensure consistent thermal and mechanical performance across batches, critical for reproducible composite formulations.
Trade-offs
- Water-soluble boron content: 0.08% water-soluble boron may leach in humid or aqueous environments, potentially affecting long-term stability in certain packaging or cosmetic applications.
- Low tap density handling: Tap density of 0.6 g/cm³ indicates a fluffy, low-bulk-density powder that may require dust control measures and careful volumetric feeding during compounding.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
