Copper Foam 110 PPI 200×200×2 mm Research Grade ATOMFAIR®

Price range: $75.00 through $165.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research-grade open-cell copper foam sheet, 110 PPI, 200 × 200 × 2 mm, 1/5 pcs, porosity 50–80%, through-pore rate ≥98%. In stock.

Laboratory Open-Cell Copper Foam, 110 PPI, 200 × 200 × 2 mm, 1/5 pcs
Research-grade laboratory product
Product Overview

Open-cell copper foam with 110 PPI provides an interconnected porous-metal structure in a 200 × 200 × 2 mm sheet. Its nominal pore pitch is approximately 0.23 mm, offering a clearly defined cellular specification for laboratory selection and engineering integration.

The material is a foamed copper sheet with a stated porosity of 50–80%, a through-pore rate of at least 98% and a bulk-density range of 0.1–0.8 g/cm³. This combination preserves the continuous open network required for high internal surface exposure while retaining the thermal and electrical characteristics associated with the copper framework.

The open copper network can be evaluated for electrode frameworks and current-collection structures, catalyst-support assemblies, heat-transfer and heat-dissipation components, filtration and water-purification media, acoustic attenuation and electromagnetic-shielding structures, and fluid-pressure buffering devices. Selection should be based on PPI, sheet dimensions, thickness, package quantity and the intended integration method.

Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-C110-20T02
Material Foamed copper
Product Form Open-cell copper foam sheet
Cell Structure Interconnected open-pore network
Pore Density 110 PPI
Nominal Pore Pitch 0.23 mm
General Pore-Size Capability 0.1–10 mm (5–120 PPI)
Porosity 50–80%
Through-Pore Rate ≥98%
Bulk Density 0.1–0.8 g/cm³
Sheet Size 200 × 200 × 2 mm
Thickness 2 mm
Package Options 1 pcs; 5 pcs
Typical Applications Electrode frameworks, catalyst supports, thermal management, filtration, acoustic attenuation, electromagnetic shielding and fluid-pressure buffering
Key Features and Advantages
  • 110 PPI open-cell structure with an approximately 0.23 mm nominal pore pitch.
  • 200 × 200 mm sheet dimensions with a 2 mm nominal thickness.
  • Interconnected pores with a stated through-pore rate of at least 98%.
  • Stated porosity range of 50–80% and bulk-density range of 0.1–0.8 g/cm³.
  • Copper framework supports thermal-transfer and electrical-conduction applications.
  • High internal surface exposure supports electrode, catalyst-carrier, filtration and acoustic-control evaluations.
  • Available in 1-piece and 5-piece package quantities.
Application Scope

Suitable for laboratory and engineering evaluations that require a 110 PPI open copper network in a 200 × 200 × 2 mm format. Relevant uses include nickel-zinc battery and electric-double-layer-capacitor electrode structures, copper-containing wastewater recovery electrodes, catalyst and photocatalytic air-purification carriers, motor and electronic-component heat-transfer parts, filtration and water-purification media, acoustic attenuation, electromagnetic shielding and pressure-instrument buffering components.

SELECTION GUIDANCE: Confirm PPI, nominal pore pitch, porosity requirement, through-pore rate, sheet length and width, thickness, bulk-density range and required quantity before quotation. Confirm any application-critical pore geometry and integration requirements before ordering.
HANDLING & INSPECTION: Store the sheets in a clean, dry area and protect the open cellular surface from heavy impact, crushing and contamination. After delivery, check the package condition, sheet dimensions and visible pore structure before cutting, bonding or installing the material.
IMPORTANT NOTICE: Custom dimensions are available upon consultation. For a dimensional feasibility review, provide the target length, width, thickness, PPI and estimated quantity.
LABORATORY PROCUREMENT SUPPORT
For PPI selection, sheet-dimension confirmation, package support or application-specific configuration review, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

Store the copper foam sheets in a clean, dry area to maintain material integrity. Protect the open cellular surface from heavy impact, crushing, and contamination during handling and storage.

  • Storage Requirements: Store in a clean, dry area and protect the open cellular surface from heavy impact, crushing and contamination.

What is the trade-off between pore density and mechanical integrity when using 110 PPI copper foam as an electrode framework?

The 110 PPI copper foam provides a nominal pore pitch of approximately 0.23 mm and a porosity of 50–80%, which maximizes internal surface area for electrode reactions but reduces the bulk density to 0.1–0.8 g/cm³. This lower density can compromise mechanical strength under compression or cyclic loading, so the material is best suited for applications where high surface exposure is prioritized over load-bearing capacity, such as in nickel-zinc battery or electric-double-layer-capacitor electrodes.

Can this 200 × 200 × 2 mm copper foam sheet be integrated into existing filtration or catalyst support assemblies without additional surface treatment?

Yes, the open-cell copper foam with a through-pore rate of at least 98% and an interconnected network can be directly used as a filtration medium or catalyst carrier, provided the 0.23 mm nominal pore pitch and 2 mm thickness meet the system's flow and loading requirements. However, for catalytic applications, the copper surface may require pre-treatment or coating to enhance activity or prevent oxidation, as the source does not specify any surface modification.

What storage and handling precautions are required to prevent damage to the 110 PPI copper foam's open cellular structure?

Store the sheets in a clean, dry area and protect the open cellular surface from heavy impact, crushing, and contamination. The 2 mm thickness and low bulk density (0.1–0.8 g/cm³) make the foam susceptible to permanent deformation under compressive loads, so avoid stacking heavy items on top of the sheets. After delivery, inspect package condition, sheet dimensions, and visible pore structure before cutting, bonding, or installing.

This 110 PPI open-cell copper foam sheet (200×200×2 mm) offers a ≥98% through-pore rate and a copper framework suitable for electrode, catalyst-support, and thermal-management evaluations, though its 50–80% porosity range and 0.1–0.8 g/cm³ bulk-density spread introduce variability in mechanical and transport properties that must be accounted for during integration.

Positive

  • High through-pore rate ≥98%: The interconnected open-pore network ensures minimal flow obstruction, making the foam suitable for fluid transport, filtration, and electrode applications where internal surface accessibility is critical.
  • Copper framework for thermal/electrical conduction: The metallic copper structure supports heat-transfer and current-collection roles, enabling use in thermal management components and electrode frameworks without additional conductive coatings.

Trade-offs

  • Porosity variability 50–80%: The stated porosity range introduces uncertainty in effective density and mechanical strength; each sheet may require individual characterization for applications with tight tolerances on pore volume or structural integrity.
  • Bulk-density spread 0.1–0.8 g/cm³: The wide bulk-density range indicates significant variation in mass per unit volume across sheets, affecting handling weight, thermal mass, and integration consistency in multi-component assemblies.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Package Quantity

1 pcs, 5 pcs

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