Open-Cell Copper Foam 40 PPI 100×200×20 mm ATOMFAIR®

Price range: $90.00 through $265.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research-grade open-cell copper foam sheet, 40 PPI, 100 × 200 × 20 mm, 50–80% porosity, ≥98% through-pore rate, 0.1–0.8 g/cm³. Order now.

Laboratory Open-Cell Copper Foam, 40 PPI, 100 × 200 × 20 mm, 1/5 pcs
Research-grade laboratory product
Product Overview

Open-cell copper foam with 40 PPI provides an interconnected porous-metal structure in a 100 × 200 × 20 mm sheet. Its nominal pore pitch is approximately 0.64 mm, offering a clearly defined cellular specification for laboratory selection and engineering integration.

The material is a foamed copper sheet with a stated porosity of 50–80%, a through-pore rate of at least 98% and a bulk-density range of 0.1–0.8 g/cm³. This combination preserves the continuous open network required for high internal surface exposure while retaining the thermal and electrical characteristics associated with the copper framework.

The open copper network can be evaluated for electrode frameworks and current-collection structures, catalyst-support assemblies, heat-transfer and heat-dissipation components, filtration and water-purification media, acoustic attenuation and electromagnetic-shielding structures, and fluid-pressure buffering devices. Selection should be based on PPI, sheet dimensions, thickness, package quantity and the intended integration method.

Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-C40-12T20
Material Foamed copper
Product Form Open-cell copper foam sheet
Cell Structure Interconnected open-pore network
Pore Density 40 PPI
Nominal Pore Pitch 0.64 mm
General Pore-Size Capability 0.1–10 mm (5–120 PPI)
Porosity 50–80%
Through-Pore Rate ≥98%
Bulk Density 0.1–0.8 g/cm³
Sheet Size 100 × 200 × 20 mm
Thickness 20 mm
Package Options 1 pcs; 5 pcs
Typical Applications Electrode frameworks, catalyst supports, thermal management, filtration, acoustic attenuation, electromagnetic shielding and fluid-pressure buffering
Key Features and Advantages
  • 40 PPI open-cell structure with an approximately 0.64 mm nominal pore pitch.
  • 100 × 200 mm sheet dimensions with a 20 mm nominal thickness.
  • Interconnected pores with a stated through-pore rate of at least 98%.
  • Stated porosity range of 50–80% and bulk-density range of 0.1–0.8 g/cm³.
  • Copper framework supports thermal-transfer and electrical-conduction applications.
  • High internal surface exposure supports electrode, catalyst-carrier, filtration and acoustic-control evaluations.
  • Available in 1-piece and 5-piece package quantities.
Application Scope

Suitable for laboratory and engineering evaluations that require a 40 PPI open copper network in a 100 × 200 × 20 mm format. Relevant uses include nickel-zinc battery and electric-double-layer-capacitor electrode structures, copper-containing wastewater recovery electrodes, catalyst and photocatalytic air-purification carriers, motor and electronic-component heat-transfer parts, filtration and water-purification media, acoustic attenuation, electromagnetic shielding and pressure-instrument buffering components.

SELECTION GUIDANCE: Confirm PPI, nominal pore pitch, porosity requirement, through-pore rate, sheet length and width, thickness, bulk-density range and required quantity before quotation. Confirm any application-critical pore geometry and integration requirements before ordering.
HANDLING & INSPECTION: Store the sheets in a clean, dry area and protect the open cellular surface from heavy impact, crushing and contamination. After delivery, check the package condition, sheet dimensions and visible pore structure before cutting, bonding or installing the material.
IMPORTANT NOTICE: Custom dimensions are available upon consultation. For a dimensional feasibility review, provide the target length, width, thickness, PPI and estimated quantity.
LABORATORY PROCUREMENT SUPPORT
For PPI selection, sheet-dimension confirmation, package support or application-specific configuration review, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

Store the copper foam sheet in a clean, dry area to prevent moisture and contamination. Inspect the package condition, sheet dimensions, and visible pore structure before any cutting, bonding, or installation.

  • Storage and Inspection: Store the copper foam sheet in a clean, dry area and protect it from heavy impact, crushing, and contamination, and inspect the package, dimensions, and pore structure before use.

How does the 40 PPI pore density correspond to the nominal pore pitch of 0.64 mm, and what performance implications does this have for applications requiring high surface area?

The 40 PPI pore density directly corresponds to a nominal pore pitch of 0.64 mm, as specified in the product technical data. This combination yields a porosity range of 50–80% and a bulk density of 0.1–0.8 g/cm³, with a through-pore rate of at least 98%. The interconnected open-pore network provides high internal surface exposure, making it suitable for electrode frameworks, catalyst supports, and filtration media where surface area is critical.

What are the key dimensional and structural parameters to verify before integrating this copper foam into a thermal management assembly?

Before integration, confirm the sheet size (100 × 200 × 20 mm), pore density (40 PPI, 0.64 mm nominal pore pitch), porosity (50–80%), through-pore rate (≥98%), and bulk density (0.1–0.8 g/cm³) as listed in the technical specifications. The handling guidance advises storing the foam in a clean, dry area and protecting it from heavy impact, crushing, and contamination to preserve the open cellular structure required for thermal transfer applications.

Does the through-pore rate of ≥98% indicate that this copper foam is suitable for fluid filtration applications requiring efficient flow?

Yes, the stated through-pore rate of at least 98% indicates a highly interconnected open-pore network, which is critical for fluid filtration and water purification applications by allowing efficient fluid passage. The 40 PPI structure with 0.64 mm nominal pore pitch provides a defined pore size, and the product is explicitly listed as suitable for filtration and water-purification media, supporting its use in such evaluations.

This 40 PPI open-cell copper foam in a 100 × 200 × 20 mm sheet offers a ≥98% through-pore rate and 50–80% interconnected porosity, enabling electrode, catalyst, thermal, and filtration evaluations, but requires careful handling and validation of pore geometry for application-specific needs.

Positive

  • High Through-Pore Rate ≥98%: The ≥98% through-pore rate ensures a continuous open network for fluid flow and maximum internal surface exposure, critical for electrode and filtration applications.
  • Interconnected Open-Cell Structure: Porosity of 50–80% with interconnected pores provides high surface area for catalyst support, thermal management, and acoustic attenuation, while retaining copper's thermal and electrical conductivity.

Trade-offs

  • Requires Careful Handling: The open cellular surface is susceptible to heavy impact, crushing, and contamination; storage must be in a clean, dry area and the sheet must be protected during cutting, bonding, or installation.
  • Pore Geometry Variability: Porosity and bulk density range widely (50–80% and 0.1–0.8 g/cm³), and pore size is specified by PPI rather than exact dimension; application-critical pore geometry must be confirmed before ordering.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Package Quantity

1 pcs, 5 pcs

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