Open-Cell Copper Foam Sheet 20 PPI 100×100×20 mm ATOMFAIR®

Price range: $75.00 through $160.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research-grade open-cell copper foam sheet, 20 PPI, 100 × 100 × 20 mm, porosity 50–80%, through-pore rate ≥98%, for lab use, 1/5 pcs. Order now.

Laboratory Open-Cell Copper Foam, 20 PPI, 100 × 100 × 20 mm, 1/5 pcs
Research-grade laboratory product
Product Overview

Open-cell copper foam with 20 PPI provides an interconnected porous-metal structure in a 100 × 100 × 20 mm sheet. Its nominal pore pitch is approximately 1.27 mm, offering a clearly defined cellular specification for laboratory selection and engineering integration.

The material is a foamed copper sheet with a stated porosity of 50–80%, a through-pore rate of at least 98% and a bulk-density range of 0.1–0.8 g/cm³. This combination preserves the continuous open network required for high internal surface exposure while retaining the thermal and electrical characteristics associated with the copper framework.

The open copper network can be evaluated for electrode frameworks and current-collection structures, catalyst-support assemblies, heat-transfer and heat-dissipation components, filtration and water-purification media, acoustic attenuation and electromagnetic-shielding structures, and fluid-pressure buffering devices. Selection should be based on PPI, sheet dimensions, thickness, package quantity and the intended integration method.

Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-C20-10T20
Material Foamed copper
Product Form Open-cell copper foam sheet
Cell Structure Interconnected open-pore network
Pore Density 20 PPI
Nominal Pore Pitch 1.27 mm
General Pore-Size Capability 0.1–10 mm (5–120 PPI)
Porosity 50–80%
Through-Pore Rate ≥98%
Bulk Density 0.1–0.8 g/cm³
Sheet Size 100 × 100 × 20 mm
Thickness 20 mm
Package Options 1 pcs; 5 pcs
Typical Applications Electrode frameworks, catalyst supports, thermal management, filtration, acoustic attenuation, electromagnetic shielding and fluid-pressure buffering
Key Features and Advantages
  • 20 PPI open-cell structure with an approximately 1.27 mm nominal pore pitch.
  • 100 × 100 mm sheet dimensions with a 20 mm nominal thickness.
  • Interconnected pores with a stated through-pore rate of at least 98%.
  • Stated porosity range of 50–80% and bulk-density range of 0.1–0.8 g/cm³.
  • Copper framework supports thermal-transfer and electrical-conduction applications.
  • High internal surface exposure supports electrode, catalyst-carrier, filtration and acoustic-control evaluations.
  • Available in 1-piece and 5-piece package quantities.
Application Scope

Suitable for laboratory and engineering evaluations that require a 20 PPI open copper network in a 100 × 100 × 20 mm format. Relevant uses include nickel-zinc battery and electric-double-layer-capacitor electrode structures, copper-containing wastewater recovery electrodes, catalyst and photocatalytic air-purification carriers, motor and electronic-component heat-transfer parts, filtration and water-purification media, acoustic attenuation, electromagnetic shielding and pressure-instrument buffering components.

SELECTION GUIDANCE: Confirm PPI, nominal pore pitch, porosity requirement, through-pore rate, sheet length and width, thickness, bulk-density range and required quantity before quotation. Confirm any application-critical pore geometry and integration requirements before ordering.
HANDLING & INSPECTION: Store the sheets in a clean, dry area and protect the open cellular surface from heavy impact, crushing and contamination. After delivery, check the package condition, sheet dimensions and visible pore structure before cutting, bonding or installing the material.
IMPORTANT NOTICE: Custom dimensions are available upon consultation. For a dimensional feasibility review, provide the target length, width, thickness, PPI and estimated quantity.
LABORATORY PROCUREMENT SUPPORT
For PPI selection, sheet-dimension confirmation, package support or application-specific configuration review, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

This copper foam sheet requires a clean, dry storage environment to prevent contamination and moisture-related degradation. The open-cell structure is vulnerable to permanent deformation from heavy impact, crushing, and compressive forces during handling and installation.

  • Storage Environment: Store the foam sheet in a clean, dry area with controlled humidity to avoid oxidation or contamination.
  • Mechanical Protection: Protect the foam from heavy impact, crushing forces, and compressive loads that can collapse the open-cell pore structure.
  • Contamination Control: Keep the foam surface free from dust, oils, and debris to maintain the open-pore network and through-pore rate.

Follow these steps to inspect, store, and process the copper foam sheet while preserving its structural integrity. Proper handling prevents pore collapse and contamination that could compromise performance.

  1. Inspect the received foam sheet
    Inspect the package condition, sheet dimensions, and visible pore structure upon delivery before any handling or processing.
  2. Store in a clean, dry environment
    Store the copper foam sheet in a clean, dry area away from heavy impact and crushing hazards to preserve the open-cell structure.
  3. Cut the foam sheet without crushing pores
    Cut the foam using a sharp blade or die-cut method to minimize pore deformation and maintain the interconnected network.

What is the significance of the ≥98% through-pore rate in 20 PPI copper foam for electrode or filtration applications?

The ≥98% through-pore rate ensures nearly all pores are interconnected, maximizing internal surface area exposure for electrochemical reactions or fluid passage. This is critical for applications like nickel-zinc battery electrodes or catalyst supports where uniform flow and high active area are required. The 20 PPI (1.27 mm nominal pore pitch) combined with 50–80% porosity provides a balance between structural integrity and permeability.

Can the 100×100×20 mm copper foam sheet be cut or shaped for custom integration without compromising its open-cell structure?

Yes, the sheet can be cut, bonded, or installed, but care must be taken to avoid crushing or contaminating the open cellular surface. The interconnected pore network with ≥98% through-pore rate is maintained if cutting methods such as wire EDM, laser cutting, or precision sawing do not deform the pore walls. After cutting, inspect the visible pore structure before integration.

What storage conditions are recommended to prevent oxidation or degradation of the copper foam before use?

Store the sheets in a clean, dry area to minimize moisture exposure that could accelerate copper oxidation. Protect the open cellular surface from heavy impact, crushing, and contamination. The copper framework supports thermal-transfer and electrical-conduction applications, but prolonged exposure to humid or corrosive environments may affect surface properties for electrode or catalyst applications.

This 20 PPI open-cell copper foam sheet (100×100×20 mm) provides an interconnected porous network with ≥98% through-pore rate and 50–80% porosity, supporting applications in electrode frameworks, catalyst supports, thermal management, and filtration. The copper framework enables thermal and electrical conduction, but the material requires careful handling and pre-order verification of pore geometry due to broad specification ranges.

Positive

  • High through-pore rate and internal surface area: The ≥98% through-pore rate and 50–80% porosity provide a continuous open network with high internal surface exposure, suitable for electrode frameworks, catalyst supports, and thermal management applications.
  • Copper framework for thermal and electrical conduction: The copper metal matrix supports thermal transfer and electrical conduction, making the foam useful for heat dissipation components and current-collection structures in batteries and capacitors.

Trade-offs

  • Requires clean, dry storage and careful handling: The open cellular surface is susceptible to contamination and mechanical damage from heavy impact or crushing; storage in a clean, dry area is required to preserve structural integrity.
  • Application-critical pore geometry must be verified before ordering: The stated porosity range (50–80%) and bulk density range (0.1–0.8 g/cm³) are broad; buyers must confirm that the actual pore geometry meets their specific integration requirements before purchase.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Package Quantity

1 pcs, 5 pcs

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