Research-Grade Open-Cell Copper Foam 20 PPI 15 mm ATOMFAIR®

Laboratory Open-Cell Copper Foam, 20 PPI, 100 × 200 × 15 mm, 1/5 pcs

Research-grade laboratory product

Product Overview

Open-cell copper foam with 20 PPI provides an interconnected porous-metal structure in a 100 × 200 × 15 mm sheet. Its nominal pore pitch is approximately 1.27 mm, offering a clearly defined cellular specification for laboratory selection and engineering integration.

The material is a foamed copper sheet with a stated porosity of 50–80%, a through-pore rate of at least 98% and a bulk-density range of 0.1–0.8 g/cm³. This combination preserves the continuous open network required for high internal surface exposure while retaining the thermal and electrical characteristics associated with the copper framework.

The open copper network can be evaluated for electrode frameworks and current-collection structures, catalyst-support assemblies, heat-transfer and heat-dissipation components, filtration and water-purification media, acoustic attenuation and electromagnetic-shielding structures, and fluid-pressure buffering devices. Selection should be based on PPI, sheet dimensions, thickness, package quantity and the intended integration method.

Technical Specifications

Parameter	Specification / Available Values
Atomfair Model	AF-C20-12T15
Material	Foamed copper
Product Form	Open-cell copper foam sheet
Cell Structure	Interconnected open-pore network
Pore Density	20 PPI
Nominal Pore Pitch	1.27 mm
General Pore-Size Capability	0.1–10 mm (5–120 PPI)
Porosity	50–80%
Through-Pore Rate	≥98%
Bulk Density	0.1–0.8 g/cm³
Sheet Size	100 × 200 × 15 mm
Thickness	15 mm
Package Options	1 pcs; 5 pcs
Typical Applications	Electrode frameworks, catalyst supports, thermal management, filtration, acoustic attenuation, electromagnetic shielding and fluid-pressure buffering

Key Features and Advantages

20 PPI open-cell structure with an approximately 1.27 mm nominal pore pitch.
100 × 200 mm sheet dimensions with a 15 mm nominal thickness.
Interconnected pores with a stated through-pore rate of at least 98%.
Stated porosity range of 50–80% and bulk-density range of 0.1–0.8 g/cm³.
Copper framework supports thermal-transfer and electrical-conduction applications.
High internal surface exposure supports electrode, catalyst-carrier, filtration and acoustic-control evaluations.
Available in 1-piece and 5-piece package quantities.

Application Scope

Suitable for laboratory and engineering evaluations that require a 20 PPI open copper network in a 100 × 200 × 15 mm format. Relevant uses include nickel-zinc battery and electric-double-layer-capacitor electrode structures, copper-containing wastewater recovery electrodes, catalyst and photocatalytic air-purification carriers, motor and electronic-component heat-transfer parts, filtration and water-purification media, acoustic attenuation, electromagnetic shielding and pressure-instrument buffering components.

SELECTION GUIDANCE: Confirm PPI, nominal pore pitch, porosity requirement, through-pore rate, sheet length and width, thickness, bulk-density range and required quantity before quotation. Confirm any application-critical pore geometry and integration requirements before ordering.

HANDLING & INSPECTION: Store the sheets in a clean, dry area and protect the open cellular surface from heavy impact, crushing and contamination. After delivery, check the package condition, sheet dimensions and visible pore structure before cutting, bonding or installing the material.

IMPORTANT NOTICE: Custom dimensions are available upon consultation. For a dimensional feasibility review, provide the target length, width, thickness, PPI and estimated quantity.

LABORATORY PROCUREMENT SUPPORT

For PPI selection, sheet-dimension confirmation, package support or application-specific configuration review, contact our technical sales team.

E-MAIL: inquiry@atomfair.com

Manufacturer: Atomfair LLC

Brand: ATOMFAIR®

What is the significance of the ≥98% through-pore rate for applications like filtration or electrode support?

The ≥98% through-pore rate ensures that nearly all pores are interconnected, maximizing fluid permeability and internal surface accessibility. This is critical for consistent flow in filtration and uniform ion transport in electrode structures. The open-cell network with 20 PPI and nominal pore pitch of 1.27 mm provides a defined cellular geometry for predictable performance.

Can this 20 PPI copper foam be used directly as a current collector in nickel-zinc batteries without additional surface treatment?

The copper foam is suitable for evaluation as an electrode framework and current-collection structure in nickel-zinc batteries and EDLCs, as stated in the application scope. However, the source does not specify surface treatment requirements; users should confirm compatibility with their specific electrolyte and integration method before ordering. The material's high through-pore rate and porosity range of 50–80% support active material loading.

What storage conditions are required to prevent oxidation of the copper foam before use?

Store the sheets in a clean, dry area and protect the open cellular surface from heavy impact, crushing, and contamination. While copper naturally forms a thin oxide layer, the source does not specify additional anti-oxidation measures; for long-term storage, consider desiccated or inert environments. Inspect package condition and visible pore structure before installation.

Assessment

This 20 PPI open-cell copper foam sheet (100 × 200 × 15 mm) offers a ≥98% through-pore rate and 50–80% porosity, providing a high-surface-area copper network suitable for electrode frameworks, catalyst supports, thermal management, and filtration applications. The interconnected pore structure with ~1.27 mm nominal pitch supports fluid transport and electrical conduction, but the broad bulk-density range (0.1–0.8 g/cm³) requires application-specific verification.

Positive

High through-pore rate: ≥98% through-pore rate ensures an interconnected open network, maximizing internal surface exposure for electrode, catalyst, and filtration applications.
Copper thermal-electrical framework: The copper matrix supports both thermal transfer and electrical conduction, making it suitable for heat-dissipation components and current-collection structures.

Trade-offs

Variable porosity and density: Stated porosity range of 50–80% and bulk density of 0.1–0.8 g/cm³ indicate significant lot-to-lot variability; users must confirm specific values for their intended application.
Sensitive to handling damage: The open cellular surface is vulnerable to crushing, impact, and contamination; storage in a clean, dry area and careful handling during cutting or installation are required.

Quality Standards & Performance Verification

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Shipping & Returns

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).