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Open-Cell Copper Foam Sheet 20 PPI 200×200×10 mm ATOMFAIR®
Open-Cell Copper Foam Sheet 20 PPI 200×200×10 mm ATOMFAIR® - Image 2

Open-Cell Copper Foam Sheet 20 PPI 200×200×10 mm ATOMFAIR®

Price range: $90.00 through $265.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Open-cell copper foam sheet, 20 PPI, 200 × 200 × 10 mm, porosity 50–80% and through-pore rate ≥98%. 1 or 5 pcs package for lab builds. Order now.

SKU: AF-AF-F-C020-T010-cVAR
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Laboratory Open-Cell Copper Foam, 20 PPI, 200 × 200 × 10 mm, 1/5 pcs
Research-grade laboratory product
Product Overview

Open-cell copper foam with 20 PPI provides an interconnected porous-metal structure in a 200 × 200 × 10 mm sheet. Its nominal pore pitch is approximately 1.27 mm, offering a clearly defined cellular specification for laboratory selection and engineering integration.

The material is a foamed copper sheet with a stated porosity of 50–80%, a through-pore rate of at least 98% and a bulk-density range of 0.1–0.8 g/cm³. This combination preserves the continuous open network required for high internal surface exposure while retaining the thermal and electrical characteristics associated with the copper framework.

The open copper network can be evaluated for electrode frameworks and current-collection structures, catalyst-support assemblies, heat-transfer and heat-dissipation components, filtration and water-purification media, acoustic attenuation and electromagnetic-shielding structures, and fluid-pressure buffering devices. Selection should be based on PPI, sheet dimensions, thickness, package quantity and the intended integration method.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-C20-20T10
Material Foamed copper
Product Form Open-cell copper foam sheet
Cell Structure Interconnected open-pore network
Pore Density 20 PPI
Nominal Pore Pitch 1.27 mm
General Pore-Size Capability 0.1–10 mm (5–120 PPI)
Porosity 50–80%
Through-Pore Rate ≥98%
Bulk Density 0.1–0.8 g/cm³
Sheet Size 200 × 200 × 10 mm
Thickness 10 mm
Package Options 1 pcs; 5 pcs
Typical Applications Electrode frameworks, catalyst supports, thermal management, filtration, acoustic attenuation, electromagnetic shielding and fluid-pressure buffering
Key Features and Advantages
  • 20 PPI open-cell structure with an approximately 1.27 mm nominal pore pitch.
  • 200 × 200 mm sheet dimensions with a 10 mm nominal thickness.
  • Interconnected pores with a stated through-pore rate of at least 98%.
  • Stated porosity range of 50–80% and bulk-density range of 0.1–0.8 g/cm³.
  • Copper framework supports thermal-transfer and electrical-conduction applications.
  • High internal surface exposure supports electrode, catalyst-carrier, filtration and acoustic-control evaluations.
  • Available in 1-piece and 5-piece package quantities.
Application Scope

Suitable for laboratory and engineering evaluations that require a 20 PPI open copper network in a 200 × 200 × 10 mm format. Relevant uses include nickel-zinc battery and electric-double-layer-capacitor electrode structures, copper-containing wastewater recovery electrodes, catalyst and photocatalytic air-purification carriers, motor and electronic-component heat-transfer parts, filtration and water-purification media, acoustic attenuation, electromagnetic shielding and pressure-instrument buffering components.
SELECTION GUIDANCE: Confirm PPI, nominal pore pitch, porosity requirement, through-pore rate, sheet length and width, thickness, bulk-density range and required quantity before quotation. Confirm any application-critical pore geometry and integration requirements before ordering.
HANDLING & INSPECTION: Store the sheets in a clean, dry area and protect the open cellular surface from heavy impact, crushing and contamination. After delivery, check the package condition, sheet dimensions and visible pore structure before cutting, bonding or installing the material.
IMPORTANT NOTICE: Custom dimensions are available upon consultation. For a dimensional feasibility review, provide the target length, width, thickness, PPI and estimated quantity.
LABORATORY PROCUREMENT SUPPORT
For PPI selection, sheet-dimension confirmation, package support or application-specific configuration review, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

Open-cell copper foam sheets require storage in a clean, dry environment to prevent contamination and oxidation. The porous structure is susceptible to crushing and impact damage, requiring careful handling during installation and processing.

  • Environmental Storage: Store sheets in a clean, dry area away from moisture and corrosive atmospheres.
  • Mechanical Protection: Protect the open cellular surface from heavy impact, crushing, and contamination during handling and storage.
  • Pre-Use Inspection: After delivery, verify package condition, sheet dimensions, and visible pore structure before cutting, bonding, or installing the material.
  • Processing Precautions: Cutting, bonding, or installing the foam may require specialized techniques to preserve pore integrity and avoid debris ingress.

How does the 50–80% porosity range affect the effective thermal and electrical conductivity of the 20 PPI copper foam sheet?

The stated porosity range of 50–80% corresponds to a bulk density of 0.1–0.8 g/cm³. Higher porosity reduces the copper volume fraction, lowering both thermal and electrical conductivity while increasing internal surface area. The copper framework retains its intrinsic conductive properties, but the effective conductivity scales with the solid fraction. For applications requiring higher conductivity, select a lower porosity within the range.

Can the 200×200×10 mm copper foam sheet be integrated into a battery electrode assembly without additional current collector layers?

Yes, the open-cell copper foam with ≥98% through-pore rate and 20 PPI structure can serve as both an electrode framework and a current collector due to its continuous copper network. The 10 mm thickness provides a three-dimensional scaffold for active material loading. However, integration should be validated for specific electrode geometries and active material adhesion, as the foam's bulk density (0.1–0.8 g/cm³) affects mechanical stability.

What are the recommended storage and handling procedures to preserve the pore structure and surface cleanliness of this copper foam?

Store the sheets in a clean, dry area to prevent contamination and oxidation. Protect the open cellular surface from heavy impact, crushing, and contamination. After delivery, inspect package condition, sheet dimensions, and visible pore structure before cutting or bonding. Avoid exposure to corrosive atmospheres that could degrade the copper surface.

This 20 PPI open-cell copper foam sheet (200 × 200 × 10 mm) provides a high through-pore rate (≥98%) and a copper backbone suitable for electrode, catalyst-support, thermal, and filtration applications. Its 50–80% porosity and 0.1–0.8 g/cm³ bulk-density range require batch-level verification, and the open cellular structure demands careful handling to avoid deformation or contamination.

Positive

  • High through-pore and internal surface area: The ≥98% through-pore rate and 50–80% porosity expose a large internal copper surface, making the sheet effective for electrode frameworks, catalyst carriers, filtration media, and acoustic or EMI control structures.
  • Copper framework for thermal and electrical conduction: The foamed copper network retains thermal and electrical conductivity, enabling use in heat-transfer components, current collectors, and electrode structures where metallic conduction is required.

Trade-offs

  • Susceptible to deformation and contamination: The open-cell structure is mechanically fragile; heavy impact, crushing, or surface contamination can damage pores and degrade performance, requiring careful storage and handling before cutting, bonding, or installation.
  • Wide porosity and density ranges: Specified porosity (50–80%) and bulk density (0.1–0.8 g/cm³) vary across batches, so application-critical performance must be verified per lot, particularly for precision electrode or filtration designs.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Package Quantity

1 pcs, 5 pcs

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