Open-Cell Copper Foam 20 PPI 100 × 200 × 2 mm ATOMFAIR®

Laboratory Open-Cell Copper Foam, 20 PPI, 100 × 200 × 2 mm, 1/5 pcs

Research-grade laboratory product

Product Overview

Open-cell copper foam with 20 PPI provides an interconnected porous-metal structure in a 100 × 200 × 2 mm sheet. Its nominal pore pitch is approximately 1.27 mm, offering a clearly defined cellular specification for laboratory selection and engineering integration.

The material is a foamed copper sheet with a stated porosity of 50–80%, a through-pore rate of at least 98% and a bulk-density range of 0.1–0.8 g/cm³. This combination preserves the continuous open network required for high internal surface exposure while retaining the thermal and electrical characteristics associated with the copper framework.

The open copper network can be evaluated for electrode frameworks and current-collection structures, catalyst-support assemblies, heat-transfer and heat-dissipation components, filtration and water-purification media, acoustic attenuation and electromagnetic-shielding structures, and fluid-pressure buffering devices. Selection should be based on PPI, sheet dimensions, thickness, package quantity and the intended integration method.

Technical Specifications

Parameter	Specification / Available Values
Atomfair Model	AF-C20-12T02
Material	Foamed copper
Product Form	Open-cell copper foam sheet
Cell Structure	Interconnected open-pore network
Pore Density	20 PPI
Nominal Pore Pitch	1.27 mm
General Pore-Size Capability	0.1–10 mm (5–120 PPI)
Porosity	50–80%
Through-Pore Rate	≥98%
Bulk Density	0.1–0.8 g/cm³
Sheet Size	100 × 200 × 2 mm
Thickness	2 mm
Package Options	1 pcs; 5 pcs
Typical Applications	Electrode frameworks, catalyst supports, thermal management, filtration, acoustic attenuation, electromagnetic shielding and fluid-pressure buffering

Key Features and Advantages

20 PPI open-cell structure with an approximately 1.27 mm nominal pore pitch.
100 × 200 mm sheet dimensions with a 2 mm nominal thickness.
Interconnected pores with a stated through-pore rate of at least 98%.
Stated porosity range of 50–80% and bulk-density range of 0.1–0.8 g/cm³.
Copper framework supports thermal-transfer and electrical-conduction applications.
High internal surface exposure supports electrode, catalyst-carrier, filtration and acoustic-control evaluations.
Available in 1-piece and 5-piece package quantities.

Application Scope

Suitable for laboratory and engineering evaluations that require a 20 PPI open copper network in a 100 × 200 × 2 mm format. Relevant uses include nickel-zinc battery and electric-double-layer-capacitor electrode structures, copper-containing wastewater recovery electrodes, catalyst and photocatalytic air-purification carriers, motor and electronic-component heat-transfer parts, filtration and water-purification media, acoustic attenuation, electromagnetic shielding and pressure-instrument buffering components.

SELECTION GUIDANCE: Confirm PPI, nominal pore pitch, porosity requirement, through-pore rate, sheet length and width, thickness, bulk-density range and required quantity before quotation. Confirm any application-critical pore geometry and integration requirements before ordering.

HANDLING & INSPECTION: Store the sheets in a clean, dry area and protect the open cellular surface from heavy impact, crushing and contamination. After delivery, check the package condition, sheet dimensions and visible pore structure before cutting, bonding or installing the material.

IMPORTANT NOTICE: Custom dimensions are available upon consultation. For a dimensional feasibility review, provide the target length, width, thickness, PPI and estimated quantity.

LABORATORY PROCUREMENT SUPPORT

For PPI selection, sheet-dimension confirmation, package support or application-specific configuration review, contact our technical sales team.

E-MAIL: inquiry@atomfair.com

Manufacturer: Atomfair LLC

Brand: ATOMFAIR®

How does the 20 PPI pore density and 1.27 mm nominal pore pitch affect the trade-off between surface area and fluid flow resistance in electrode or filtration applications?

The 20 PPI (pores per inch) with a nominal pore pitch of 1.27 mm provides a balance between high internal surface exposure and moderate fluid permeability. The stated porosity of 50–80% and through-pore rate of at least 98% ensure an interconnected open network, while the bulk density range of 0.1–0.8 g/cm³ indicates a lightweight structure. This combination supports applications requiring both surface area for reactions or capture and manageable pressure drop, such as electrode frameworks or filtration media.

What are the key integration constraints when using this 2 mm thick copper foam sheet in a nickel-zinc battery electrode or catalyst support assembly?

The 100 × 200 × 2 mm sheet with an open-cell copper network must be evaluated for compatibility with the intended electrochemical or catalytic environment. The copper framework provides thermal and electrical conduction, but the selection guidance emphasizes confirming PPI, pore geometry, and integration requirements before ordering. For battery electrodes, the high through-pore rate (≥98%) supports electrolyte access, while for catalyst supports, the high internal surface exposure aids dispersion. Custom dimensions are available upon consultation.

What storage and handling precautions are required to maintain the structural integrity of the open-cell copper foam?

Store the sheets in a clean, dry area and protect the open cellular surface from heavy impact, crushing, and contamination. After delivery, inspect the package condition, sheet dimensions, and visible pore structure before cutting, bonding, or installing the material. These precautions preserve the interconnected pore network and prevent deformation that could compromise performance in electrode, filtration, or thermal management applications.

Assessment

This 20 PPI open-cell copper foam sheet (100×200×2 mm) provides a high through-pore rate (≥98%) and adjustable porosity (50–80%) with a copper framework enabling both electrical and thermal conduction, suitable for electrode, catalyst, and heat-transfer evaluations; however, the open cellular structure demands careful handling and storage to prevent crushing and contamination.

Positive

High through-pore rate: The ≥98% through-pore rate ensures a continuous open network for fluid flow and maximizes internal surface exposure, critical for electrode, catalyst, and filtration applications.
Dual electrical and thermal conductivity: The copper framework provides both electrical and thermal conduction, enabling use in current-collection structures and heat-transfer components without additional conductive additives.

Trade-offs

Sensitive to handling and contamination: The open cellular surface is vulnerable to crushing, heavy impact, and contamination, requiring clean, dry storage and careful handling during cutting, bonding, or installation.
Application-specific verification required: The stated porosity and pore geometry may not meet all application requirements; confirmation of pore geometry and integration method is necessary before ordering to ensure fit.

Quality Standards & Performance Verification

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Shipping & Returns

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).