Copper Foam Sheet 60–98% Porosity 500×500mm ATOMFAIR®

COPPER FOAM 60-98% POROSITY ≥98% THROUGH-HOLE THERMAL CONDUCTIVE ELECTRODE

ADVANCED POROUS METAL MATERIAL

Copper Foam

Copper foam features 60-98% porosity, ≥98% through-hole rate, 5-130PPI, and excellent thermal conductivity (>6W/(m²·K)). With superior electrical conductivity and mechanical strength (≥2.5MPa), it is widely used for battery electrodes, heat dissipation, EMI shielding, filtration and catalysis. Custom sizes available.

I. Applications

Heat dissipation materials, heat absorption materials, chemical catalyst carriers, electromagnetic shielding materials, filter materials, damping materials, battery electrode materials, sound-absorbing materials, decorative materials.

Copper Foam Technical Parameters

Parameter	Specification
Heat Transfer Coefficient	>6 W/(m²·K)
Mechanical Strength	≥2.5 MPa
Tensile Strength	5–18 KPa
Pore Size	0.1–10 mm
Porosity	60%–98%
Through-hole Rate	≥98%
Bulk Density	>0.1 g/cm³
PPI (Pores Per Inch)	5–130

II. Main Features

Copper foam has excellent thermal conductivity, widely used for heat conduction and dissipation in motors, electrical appliances and electronic components.
Copper foam has superior electrical conductivity, with applications in nickel-zinc batteries and electric double-layer capacitor electrode materials gaining significant industry attention.
With unique structure and human-friendly properties, copper foam is an excellent medical filtration material and water purification filter medium.

III. Application Areas

Electrode Materials: The excellent electrical conductivity makes copper foam widely applicable as skeletal electrode material for new-type batteries such as nickel-zinc batteries and electric double-layer capacitors. It has been trialed and put into batch use by several manufacturers, and is expected to be promoted as a current collector for electric double-layer capacitor electrodes, with broad prospects in electrolytic recovery of copper-containing wastewater.
Catalysts: In many organic chemical reactions, copper foam with large specific surface area can replace punched copper plates as chemical reaction catalysts, and has achieved successful application as a carrier for photocatalytic air purification.
Thermal Conduction Materials: Copper foam has excellent thermal conductivity, making it an outstanding flame-retardant material applied in many advanced fire-fighting equipment overseas, especially effective in flame isolation. It can also be made into heat dissipation components for motors and electrical appliances.
Sound Absorption and Shielding Materials: Sound waves undergo diffuse reflection on the copper foam surface, achieving noise reduction through expansion silencing and micro-pore sound absorption. Copper’s EMI shielding performance is close to silver, making it an excellent electromagnetic shielding material.
Filter Materials: With excellent structural properties and human-friendly characteristics, copper foam has mature application as filter material, with promising prospects in water purification devices.
Fluid Pressure Buffering Materials: Copper foam provides dispersion and buffering for fluids, serving as an effective pressure reduction protection device for various pressure instruments.

Sizes can be customized. For any questions or specific customization requirements, please feel free to contact us at inquiry@atomfair.com

TAILORED SOLUTIONS FOR RESEARCH

Contact our engineering team for technical support or official quotations.

EMAIL: inquiry@atomfair.com

Manufacturer: Atomfair LLC

Brand: ATOMFAIR®

What is the optimal porosity range of Atomfair copper foam for balancing thermal conductivity and mechanical strength?

The entire 60–98% porosity range simultaneously delivers thermal conductivity >6 W/(m²·K) and mechanical strength ≥2.5 MPa, as specified in the technical parameters. No trade-off is required because the through-hole rate of ≥98% ensures efficient heat transport while the porous structure maintains the minimum strength across all porosity levels.

Is Atomfair copper foam suitable as a carrier for photocatalytic air purification applications?

Yes, copper foam is described as having a large specific surface area and has been successfully applied as a carrier for photocatalytic air purification. Its high porosity (60–98%) and ≥98% through-hole rate provide extensive surface area for catalyst loading while maintaining good gas permeability.

What is the tensile strength of Atomfair copper foam and how does it affect handling?

The tensile strength ranges from 5 to 18 KPa, which is relatively low. This means the foam is mechanically delicate and should be handled with care during cutting, installation, or integration into devices to avoid tearing or permanent deformation.

Assessment

This variable copper foam product offers 60–98% porosity with ≥98% through-hole rate and thermal conductivity >6 W/(m²·K), making it suitable for battery electrodes, heat dissipation, and EMI shielding across four thickness variations from 5 mm to 20 mm.

Positive

High through-hole porosity: Porosity of 60–98% with ≥98% through-hole rate ensures excellent fluid permeability and surface area for catalytic or electrode applications.
Superior thermal and electrical conductivity: Thermal conductivity >6 W/(m²·K) and electrical conductivity suitable for nickel-zinc battery electrodes and heat dissipation components, with mechanical strength ≥2.5 MPa.

Trade-offs

Low tensile strength range: Tensile strength of 5–18 KPa indicates limited mechanical robustness under tension, requiring careful handling during integration into structural assemblies.
Bulk density constraint: Bulk density >0.1 g/cm³ may restrict buoyancy or lightweight design requirements in certain filtration or sound-absorbing setups.

Quality Standards & Performance Verification

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Shipping & Returns

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).