Acid-Alkali Resistant Copper Foam 100×180×3mm ATOMFAIR®

COPPER FOAM ACID ALKALI RESISTANT 99% OPEN RATE THERMAL EMI FILTER

ADVANCED POROUS METAL MATERIAL

Copper Foam

Copper foam features excellent mechanical and processing properties, superior electrical and thermal conductivity, with a three-dimensional porous internal structure. It combines copper’s inherent alkali and acid corrosion resistance, good tensile strength and ductility, along with effective electromagnetic shielding and sound absorption/vibration damping capabilities. With 99% open rate, 100 mesh, and ≥98% through-hole rate, it is ideal for CPU/GPU/LED heat dissipation, battery electrodes, EMI shielding, filtration and catalysis. Custom sizes available.

Basic Specifications

Parameter	Specification
Tolerance	Alkali resistant, Acid resistant
Material	Copper wire
Type	Medium efficiency
Application	Dry filtration
Applicable Object	Coal
Open Rate	99%
Weave Method	Plain weave
Filament Diameter	0.01-10mm
Mesh Count	100 (mesh/inch)
Radial Breaking Strength	0.2 N/cm
Width	0.5m
Applicable Scope	Air conditioning, sugar refining, filters, fuel tanks, range hoods, faucets, water purifiers, coffee machines, air purifiers, sinks, filter kettles, aquatics

I. Pore Characteristics and Bulk Density

Parameter	Specification
Pore Size	0.1mm-10mm (5-120ppi)
Porosity	50%-98%
Through-hole Rate	≥98%
Bulk Density	0.1-0.8 g/cm³

II. Main Features

Copper foam has excellent thermal conductivity and can be used for heat conduction and dissipation in motors, electrical appliances and electronic components.
Due to its superior electrical conductivity, copper foam is gaining industry attention for applications as electrode materials in nickel-zinc batteries and electric double-layer capacitors.
Thanks to its structural characteristics and human-friendly properties, copper foam is also an excellent medical filtration material and water purification filter medium.

III. Application Areas

Electrode Materials: The excellent electrical conductivity allows copper foam to be applied as skeletal electrode material for new-type batteries such as nickel-zinc batteries and electric double-layer capacitors. It has been trialed and put into batch use by several nickel-zinc battery manufacturers. It is also expected to be promoted as a current collector for electric double-layer capacitor electrodes. Moreover, copper foam used as an electrode material for electrolytic recovery of copper-containing wastewater shows very broad prospects.
Catalysts: In many organic chemical reactions, people attempt to directly use copper foam with large specific surface area to replace punched copper plates as chemical reaction catalysts. Copper foam as a carrier for photocatalytic air purification has also been successfully applied.
Thermal Conduction Materials: Copper foam has excellent thermal conductivity, making it a superior flame-retardant material applied in many advanced fire-fighting equipment overseas, especially as a flame isolation device with outstanding effects. Additionally, using its excellent thermal conductivity and apparent permeability, copper foam is made into heat dissipation materials for motors and electrical appliances.
Sound Absorption and Shielding Materials: Sound waves undergo diffuse reflection on the surface of copper foam, achieving noise reduction through expansion silencing and micro-pore sound absorption principles. The shielding performance of copper is close to silver, making it an excellent electromagnetic shielding material.
Filter Materials: With excellent structural characteristics and human-friendly properties, copper foam metal products have been successfully applied as filter materials. Copper foam also shows good prospects in water purification device applications.
Fluid Pressure Buffering Materials: The dispersion and buffering effect of copper foam on fluids makes it an effective pressure reduction protection device for various pressure instruments.

Composition Indicators (ppm)

Element	Cu	Ni	Fe	S	C	Si
Guideline (ppm)	Balance	0.5~5%	≤100	≤80	≤100	≤50

Sizes can be customized. For any questions or specific customization requirements, please feel free to contact us at inquiry@atomfair.com

TAILORED SOLUTIONS FOR RESEARCH

Contact our engineering team for technical support or official quotations.

EMAIL: inquiry@atomfair.com

Manufacturer: Atomfair LLC

Brand: ATOMFAIR®

How does the 99% open rate and ≥98% through-hole rate of this copper foam affect its performance as a battery electrode current collector compared to solid copper foil?

The 99% open rate and ≥98% through-hole rate create a three-dimensional porous structure that dramatically increases the surface area available for electrochemical reactions while maintaining electrical conductivity. This makes it suitable as a skeletal electrode material for nickel-zinc batteries and electric double-layer capacitors, where the high porosity allows for better electrolyte penetration and active material loading compared to solid copper foil, though the trade-off is reduced mechanical strength per unit volume.

Can this 100mm*180mm*3mm copper foam sheet be directly integrated into a CPU/GPU heat dissipation assembly without additional surface treatment?

Yes, the copper foam's excellent thermal conductivity and plain weave structure allow it to be used directly as a heat dissipation material for motors, electrical appliances, and electronic components including CPU/GPU/LED assemblies. The 0.1-0.8 g/cm³ bulk density and 0.1mm-10mm pore size range provide a balance of thermal transport and permeability, but integration may require mechanical compression or bonding to ensure adequate thermal contact with the heat source.

What handling precautions are required for this copper foam given its 0.2 N/cm radial breaking strength and 0.01-10mm filament diameter?

The low radial breaking strength of 0.2 N/cm means the foam is mechanically fragile and can be easily torn or deformed under tension, so handling should avoid pulling or stretching forces. The fine filament diameter range of 0.01-10mm also means the edges can be sharp, and the high porosity structure can trap particulates, so gloves and clean handling are recommended to prevent contamination or injury during cutting or installation.

Assessment

This copper foam product features 99% open rate and ≥98% through-hole rate with pore sizes from 0.1mm to 10mm, offering high fluid permeability and surface area for applications in filtration, catalysis, and electrode materials. Its combination of electrical and thermal conductivity supports use in heat dissipation and battery current collectors, but the low radial breaking strength of 0.2 N/cm requires careful handling during integration.

Positive

High porosity and open structure: With 99% open rate and ≥98% through-hole rate, the copper foam provides excellent fluid permeability and large surface area, beneficial for filtration, catalysis, and electrode applications.
Dual electrical and thermal conductivity: Copper foam combines superior electrical conductivity for use as electrode material in batteries and capacitors with excellent thermal conductivity for heat dissipation in motors and electronics.

Trade-offs

Low mechanical strength: Radial breaking strength is only 0.2 N/cm, indicating the foam is mechanically delicate and may require careful handling during cutting, mounting, or under flow-induced stress.

Quality Standards & Performance Verification

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Shipping & Returns

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).