FREE SHIPPING with $59 or More. New Customer? Inquire for Major Discount & Free Samples! Online Payments & POs Accepted.

Copper Foam ≥99.9% Pure, 0.1-35 mm, 10-130 PPI ATOMFAIR®

Copper Foam ≥99.9% Pure, 0.1-35 mm, 10-130 PPI ATOMFAIR®

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

≥99.9% copper foam with 10-130 PPI pores, 0.1-35 mm thickness, 75%-98% porosity and ≥97% open-cell rate for electrodes and shielding. Order now.

SKU: AFMSJJKT976
Category:
Brands:

Core Product Parameters

Item Specification Parameters
Name Copper Foam
Pore Size 10PPI-130PPI, 5μm-45μm
Thickness 0.1mm-35mm
Purity ≥99.9%
Porosity 75%-98%
Open Cell Rate ≥97%
Area Density 280g/m²-4800g/m²
Maximum Dimension 500mm×1000mm×H (Customizable)
Standard Dimensions 100mm×100mm×0.15mm/100mm×100mm×0.2mm/300mm×200mm×1.0mm/200mm×300mm×1.5mm/200mm×300mm1.6mm
Cutting Method Wire Cutting, Laser Cutting, Special-Shaped Part Processing

Key Performance Features

  1. Excellent thermal conductivity enables efficient heat transfer, suitable for various heat dissipation scenarios.
  2. Superior electrical conductivity provides reliable conductive support for electrode-related applications.
  3. Possesses a unique three-dimensional interconnected network structure and is basically harmless to the human body.
  4. Good mechanical toughness allows adaptation to usage requirements under different working conditions.
  5. Outstanding electromagnetic shielding performance, comparable to that of silver.

Applicable Application Fields

  1. Electrode Materials: Can be used as the electrode skeleton material for new-type batteries such as nickel-zinc batteries and supercapacitors, which have been trialed and mass-produced by many relevant manufacturers. It is also suitable as an electrode material for electrolytic recovery of copper-containing wastewater, with broad application prospects.
  2. Catalyst Carrier: Leveraging its high specific surface area advantage, it can replace punched copper plates as a catalyst for various organic chemical reactions. It has achieved successful application as a carrier in the field of photocatalytic air purification.
  3. Thermal Conductive and Heat Dissipating Materials: Due to its good thermal conductivity, it serves as a high-performance flame-retardant material, widely used in advanced fire-fighting equipment, especially exhibiting excellent effectiveness in flame isolation. Additionally, it can be made into heat-dissipating materials for motors and electrical appliances, balancing thermal conductivity and apparent permeability.
  4. Sound-Absorbing and Electromagnetic Shielding Materials: Sound waves undergo diffuse reflection on its surface, achieving sound absorption through principles such as expansion silencing and micropore silencing. Its excellent electromagnetic shielding performance can meet various electromagnetic shielding requirements.
  5. Filter Materials: Relying on its superior structural characteristics and being basically harmless to the human body, it has been successfully applied in the medical filtration field. It also holds good application prospects in water purification devices.
  6. Fluid Pressure Buffering Materials: It has a good dispersion and buffering effect on fluids, making it an excellent pressure reduction and protection device for various pressure gauges with outstanding usage effects.

How does the area density of copper foam influence its thermal conductivity and weight for heat dissipation applications?

The copper foam's area density ranges from 280 g/m² to 4800 g/m². Higher area densities increase copper mass, enhancing thermal conductivity for efficient heat dissipation but also raising weight. This trade-off allows designers to select the optimal balance for motor and electrical appliance heat sinks.

What dimensional customization options are available for integrating copper foam into electrode assemblies for supercapacitors and nickel-zinc batteries?

The copper foam is available in standard dimensions such as 100mm×100mm×0.15mm and can be customized up to 500mm×1000mm with thickness from 0.1mm to 35mm. Cutting methods include wire cutting and laser cutting for special-shaped part processing, enabling tailored integration into electrode designs for supercapacitors and nickel-zinc batteries.

What cutting methods are recommended for copper foam to maintain its structural integrity during integration into filter or shielding assemblies?

Copper foam can be cut by wire cutting or laser cutting to produce precise shapes without damaging its three-dimensional network structure. Special-shaped part processing is also available. These methods ensure the foam maintains its mechanical toughness and open-cell architecture required for medical filtration and electromagnetic shielding applications.

This copper foam product offers high purity (≥99.9%), high porosity (75-98%), and an open cell rate ≥97%, making it suitable for applications in battery electrodes, catalyst carriers, thermal management, and electromagnetic shielding. However, the maximum dimension of 500mm×1000mm and the need for specialized cutting methods may require careful planning for large-scale or custom-shaped deployments.

Positive

  • High conductivity and porous structure: Excellent thermal and electrical conductivity combined with a three-dimensional interconnected network, high porosity (75-98%), and open cell rate ≥97% enable efficient heat transfer and reliable electrode support.
  • EM shielding and mechanical toughness: Electromagnetic shielding performance comparable to silver, along with good mechanical toughness, allows adaptation to diverse working conditions and shielding requirements.

Trade-offs

  • Maximum dimension constraint: The maximum available dimension is 500mm×1000mm×H, which may limit use in applications requiring larger continuous sheets without custom fabrication.
  • Specialized cutting required: Wire cutting, laser cutting, or special-shaped processing is needed for dimensioning, adding complexity and potential cost for non-standard shapes.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Related Products