Copper Foam 0.1–10mm Pore ≥98% Through Porosity ATOMFAIR®

COPPER FOAM 0.1-10MM PORE ≥98% THROUGH POROSITY THERMAL EMI

ADVANCED POROUS METAL MATERIAL

Copper Foam

Copper foam features high porosity and superior conductivity. With 0.1-10mm pore size, it is ideal for battery electrodes, heat dissipation, filtration and electromagnetic shielding. Custom sizes available.

I. Technical Parameters

Parameter	Specification
Pore Size	0.1mm–10mm
Porosity	60%–80%
Through-hole Rate	≥98%
Bulk Density	0.1–0.8 g/cm³
PPI (Pores Per Inch)	5–130
Tensile Strength	5–18 KPa
Compressive Strength	≥250 KPa
Mechanical Strength	2–5 MPa
Temperature Resistance	≥900°C
Heat Transfer Coefficient	>6 W/(m²·K)

II. Main Features

Copper foam exhibits excellent thermal conductivity and is widely used for heat conduction and dissipation in motors, electrical appliances, and electronic components.
Its outstanding electrical conductivity has drawn significant industry attention for applications in nickel-zinc batteries and electrode materials for electric double-layer capacitors.
Thanks to its unique structural characteristics and environmentally friendly, non-hazardous properties, copper foam also serves as a high-performance filtration and water purification material.

III. Application Areas

Electrode Materials: The excellent electrical conductivity makes copper foam suitable as a skeletal electrode material for new-type batteries such as nickel-zinc batteries and electric double-layer capacitors. It has been adopted in volume by several nickel-zinc battery manufacturers. It can also be used as a current collector for electric double-layer capacitor electrodes and holds broad prospects in the electrolytic recovery of copper-containing wastewater.
Catalysts: In many organic chemical reactions, high-specific-surface-area copper foam can replace punched copper plates as a catalyst. It also works effectively as a carrier for photocatalytic air purification.
Thermal Conduction Materials: Its excellent thermal conductivity makes copper foam a highly efficient flame-retardant material, suitable for high-end fire-fighting equipment and flame isolation. It can also be used in heat-dissipating components for motors, electrical appliances, and other equipment.
Acoustic and Electromagnetic Shielding Materials: Sound waves undergo diffuse reflection on the surface of copper foam, achieving noise reduction through expansion and micro-pore sound absorption mechanisms. The electromagnetic shielding performance of copper is close to that of silver, making copper foam a high-quality electromagnetic shielding material.
Filter Materials: With outstanding structural properties and being human-friendly, copper foam can be used as a filter material and shows good application prospects in water purification devices.
Fluid Pressure Buffering Materials: It provides dispersion and buffering for fluids and can be used as a pressure reduction protection device for various pressure instruments.

Applications

Heat dissipation materials, heat absorption materials, chemical catalyst carriers, electromagnetic shielding materials, filter materials, damping materials, battery electrode materials, sound-absorbing materials, decorative materials

Sizes can be customized. For any questions or specific customization requirements, please feel free to contact us at inquiry@atomfair.com

TAILORED SOLUTIONS FOR RESEARCH

Contact our engineering team for technical support or official quotations.

EMAIL: inquiry@atomfair.com

Manufacturer: Atomfair LLC

Brand: ATOMFAIR®

How does the pore size range of 0.1-10mm in Atomfair copper foam affect its suitability for battery electrode versus EMI shielding applications?

Pore size directly influences application performance. For battery electrodes, smaller pores (0.1-1mm) provide higher surface area for active material loading and ion transport, while larger pores (5-10mm) are better for EMI shielding due to lower electrical resistance and higher conductivity. The foam's porosity of 60-80% and through-hole rate ≥98% remain consistent across pore sizes, but mechanical strength varies from 2-5 MPa, with smaller pores offering higher strength.

What are the critical compatibility factors for using Atomfair copper foam as a catalyst carrier in high-temperature organic reactions?

As a catalyst carrier, copper foam's high specific surface area and temperature resistance ≥900°C make it suitable for organic reactions. The through-hole porosity ≥98% ensures uniform reactant flow, while the pore size (0.1-10mm) can be selected to match catalyst particle size. However, the copper surface may catalyze unwanted side reactions in certain chemistries, so compatibility testing is recommended. The foam's tensile strength of 5-18 KPa provides sufficient mechanical integrity for fixed-bed reactors.

What handling precautions are necessary to preserve the through-hole structure of Atomfair copper foam during installation in thermal management systems?

Atomfair copper foam has a through-hole rate ≥98% and compressive strength ≥250 KPa, indicating it can withstand moderate pressure but may be damaged by sharp bending or compression. During installation, avoid excessive force that could collapse the porous structure. The material is non-hazardous and environmentally friendly, but sharp edges from cutting may require protective gloves. For thermal applications, the heat transfer coefficient >6 W/(m²·K) is maintained only if the foam is not compressed beyond its elastic limit.

Assessment

This copper foam product offers high through-hole porosity (≥98%) and temperature resistance (≥900°C), making it suitable for battery electrodes, heat dissipation, filtration, and catalysis. However, its low mechanical strength (2–5 MPa) and wide pore size range (0.1–10 mm) require careful application-specific selection and handling.

Positive

High through-hole porosity: With a through-hole rate ≥98%, the foam ensures excellent fluid permeability and filtration efficiency, critical for electrode and catalyst applications.
High temperature resistance: Rated for ≥900°C, the material maintains structural integrity in high-temperature environments such as catalytic reactors and thermal management systems.

Trade-offs

Low mechanical strength: Tensile strength (5–18 KPa) and compressive strength (≥250 KPa) are low, requiring careful handling and limiting use in load-bearing or vibration-prone setups.
Wide pore size distribution: Pore size ranges from 0.1 mm to 10 mm, which may necessitate specific size selection to ensure uniformity in filtration, fluid flow, or electrode performance.

Quality Standards & Performance Verification

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Shipping & Returns

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).