Copper Foam 95–98% Porosity 30–140 PPI Electrode ATOMFAIR®

Price range: $40.00 through $100.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Copper foam with 95–98% porosity, 30–140 PPI and ≥98% through-hole rate for EMI shielding, heat dissipation, filtration and battery electrodes. Order now.

COPPER FOAM 95-98% POROSITY SOUND ABSORPTION EMI SHIELDING ELECTRODE

ADVANCED POROUS METAL MATERIAL

Copper Foam

Copper foam features ultra-high 95-98% porosity, 30-140PPI pore density, and ≥98% through-hole rate. With superior sound absorption, EMI shielding, thermal dissipation, and electrical conductivity, it is widely used for battery electrodes, filtration, catalysis and heat dissipation applications. Custom sizes available.

I. Technical Parameters

Parameter Specification
Thickness Range 0.8-10mm
PPI Range 30-140
Porosity 95-98%
Through-hole Rate ≥98%
Pore Size 0.3mm-7mm (10-140ppi)
Areal Density 100-2000 g/m²
Bulk Density 0.1-2.0 g/cm³

II. Main Features

  • Sound Absorption: Porous structure produces diffuse reflection of sound waves and micro-pore silencing to achieve noise reduction effects.
  • Specific Surface Area: Under the same through-hole rate, it possesses a larger specific surface area compared to other porous materials.
  • Electromagnetic Shielding: Provides excellent electromagnetic shielding performance.
  • Processing Performance: Can be easily cut, stamped, bent and subjected to other machining operations.
  • Heat Dissipation: Excellent thermal dissipation performance for electronic component cooling and flame-retardant materials.
  • Air Permeability: Stable gas and fluid flow characteristics suitable for filtration applications.
  • Electrical Conductivity: Excellent electrical conductivity for battery electrode material applications.

III. Application Areas

  • Electrode Materials: Applied as skeletal electrode material for nickel-zinc batteries, electric double-layer capacitors and other battery types.
  • Catalysts: Utilizing its large specific surface area as a chemical reaction catalyst or catalyst carrier.
  • Thermal Conduction Materials: Flame isolation equipment, motor and electrical appliance heat dissipation materials.
  • Filter Materials: Filtration and water purification applications.
  • Buffer Materials: Pressure reduction protection devices for pressure instruments.

Sizes can be customized. For any questions or specific customization requirements, please feel free to contact us at inquiry@atomfair.com
TAILORED SOLUTIONS FOR RESEARCH
Contact our engineering team for technical support or official quotations.
EMAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

How does pore density (PPI) affect the trade-off between specific surface area and fluid flow resistance in copper foam?

Higher PPI (up to 140) yields smaller pores (down to 0.3 mm) and a larger specific surface area, which enhances catalysis and electrode performance. However, it also increases fluid flow resistance, which may limit throughput in filtration or air permeability applications. The source confirms a PPI range of 30–140, pore size of 0.3–7 mm, and that the foam possesses a larger specific surface area compared to other porous materials while retaining stable gas and fluid flow characteristics.

What are the critical parameters to consider when integrating copper foam as an electrode material in nickel-zinc batteries?

The copper foam must match the battery design in thickness (0.8–10 mm), porosity (95–98%), and areal density (100–2000 g/m²) to ensure proper electrolyte wetting and efficient current collection. The ≥98% through-hole rate guarantees an open, interconnected structure critical for ion transport. The source explicitly lists these parameters under Technical Parameters and identifies electrode materials for nickel-zinc batteries as a key application area.

What machining capabilities are required to process copper foam for custom applications?

Copper foam can be easily cut, stamped, bent, and subjected to other standard metalworking operations using conventional sheet metal fabrication tools. No specialized equipment beyond typical workshop machinery is needed. The source states under Processing Performance that the foam 'can be easily cut, stamped, bent and subjected to other machining operations.'

Copper foam with 95-98% porosity and 30-140 PPI offers high specific surface area and multifunctional properties for battery electrodes, catalysis, filtration, and thermal management. The material is easily machinable but requires careful selection of pore density and thickness for specific applications.

Positive

  • Ultra-high porosity and through-hole rate: Porosity of 95-98% and ≥98% through-hole rate provide a very large specific surface area, beneficial for electrode materials, catalyst carriers, and filtration applications.
  • Multifunctional performance: Combines sound absorption, EMI shielding, thermal dissipation, and electrical conductivity in a single porous metal structure, suitable for diverse laboratory and industrial uses.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

size

100mm*100mm*2mm, 200mm*280mm*3mm, 500mm*200mm*5mm