COPPER FOAM 60PPI 60-98% POROSITY THERMAL CONDUCTIVE EMI SHIELDINGADVANCED POROUS METAL MATERIAL
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TAILORED SOLUTIONS FOR RESEARCH
Contact our engineering team for technical support or official quotations.
EMAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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How does the 60 PPI pore density balance thermal conductivity and mechanical strength for battery electrode applications?
The 60 PPI copper foam provides a thermal conductivity >6 W/(m²·K) and mechanical strength ≥2.5 MPa, with tensile strength of 5–18 kPa. This balance supports its use as a battery electrode matrix, where high thermal dissipation and structural integrity are required. The porosity range (60–98%) allows further tuning for specific heat or strength priorities.
What are the corrosion resistance limitations of copper foam compared to nickel foam for battery electrode carriers?
Copper foam offers lower cost and excellent electrical conductivity, but its corrosion resistance is inferior to nickel foam, which limits its application in certain battery chemistries. The source explicitly states its corrosion resistance is 'not as good as nickel,' so it is best suited for environments where corrosion is less critical or can be mitigated.
What handling precautions are required due to the low tensile strength of copper foam?
Copper foam has a tensile strength of only 5–18 kPa, making it mechanically fragile and prone to tearing under stress. Careful handling and support during cutting, mounting, or integration into assemblies is necessary to avoid permanent deformation or damage.
This 60 PPI copper foam with 60–98% porosity and ≥98% through-hole rate offers high thermal conductivity (>6 W/(m²·K)) and mechanical strength (≥2.5 MPa), making it suitable for battery electrodes, heat dissipation, and EMI shielding, though its corrosion resistance is inferior to nickel foam, limiting certain applications.
Positive
- High thermal conductivity and porosity: With a heat transfer coefficient >6 W/(m²·K) and porosity ranging from 60–98%, this copper foam provides efficient heat dissipation and fluid permeability, beneficial for thermal management and filtration applications.
- Excellent through-hole rate for flow: The ≥98% through-hole rate ensures minimal flow resistance, making it effective as a catalyst carrier or filter material where uniform fluid distribution is critical.
Trade-offs
- Lower corrosion resistance than nickel: Copper foam exhibits inferior corrosion resistance compared to nickel foam, which restricts its use in aggressive chemical environments or long-term electrochemical applications without protective coatings.
- Mechanical strength limits structural use: With a tensile strength of only 5–18 kPa, the foam is mechanically fragile and may deform under load, requiring careful handling and limiting its use as a standalone structural component.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
