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ATOMFAIR® nickel plated copper battery anode tabs piled inside an open black plastic storage case on a white background.

DNP Nickel-Plated Copper Anode Tabs 3×0.1 mm ATOMFAIR®

$55.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Premium DNP adhesive film on 3×0.1 mm nickel-plated copper anode tabs. No delamination after 4h at 85°C in electrolyte. Research grade. In stock.

Quantity Price
1 – 4 $55.00
5 – 9 $69.95
10+ $59.95
SKU: AFMSTOVP486
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Description

ATOMFAIR® NI-PLATED COPPER BATTERY ANODE TABS (3 × 0.1 MM)

RESEARCH GRADE MATERIAL

Product Overview
ATOMFAIR® premium research-grade **nickel-plated copper tabs** deliver an advanced bimetallic architecture for state-of-the-art **pouch cell engineering** and multi-ampere electrode evaluation scenarios. Utilizing a standardized geometry of **3 × 0.1 mm**, the high-performance core copper substrate provides unparalleled current density thresholds while the external passivated surface guarantees exceptional chemical and electrolyte compatibility. Pre-integrated with high-bond DNP adhesive film, these durable terminal components mitigate thermal-mechanical stress during intense high-rate cycling analysis, offering corporate R&D divisions and academic faculties uniform baseline conductivity via optimized **ni-plated copper** integration that remains free from degradation.

Technical Specifications
PARAMETER DETAILS
Substrate Material High-Purity Copper (Cu) Core with Precision Electroplated Nickel (Ni) Protective Barrier
Default Physical Dimensions 3.0 mm (Width) × 0.1 mm (Thickness)
Polymer Adhesive Interface DNP Black High-Performance Film (Default)
Mechanical Flexibility 180° Reverse Bending Cycles ≥ 7 Times
Corrosion & Bonding Resistance No delamination/corrosion after 4 hours in electrolyte at 85°C
Standard Packing Unit 100 Pieces per Box
Shelf Life & Warranty 12 Months (Under sealed validation)
Alternative Options Explore our related catalog or custom dimensions. For urgent technical custom requests or bulk inquiries, please contact our support team.

Key Features & Advantages
  • Bimetallic Dual-Layer Advantage: Integrates the superior low ohmic internal resistance of copper with the anti-corrosive properties of nickel, tailored specifically for extreme high-ampere C-rate profiles.
  • Thermal-Chemical Hermetic Shielding: Default DNP black polymer configuration withstands extreme hot-pressing schedules, preventing any cross-layer interface delamination in aggressive organic environments.
  • Fatigue-Resistant Structural Integrity: Achieves a mechanical rating of ≥ 7 alternate 180° bends, shielding inner core tracks from structural fracturing during continuous cell-stacking workflows.
  • Standardized High-Volume Packaging: Provided in expanded 100-piece box arrays to maximize cost-efficiency and ensure continuity throughout continuous pilot line assembly loops.

APPLICATION SCOPE: Explicitly optimized for high-power pouch cell assembly, high-drain rate electrochemical testing, multi-ampere charging kinetics modeling, and validation studies for advanced non-aqueous electrolyte matrices within cleanrooms and university institutions.
PACKAGING: Sealed hermetically in dedicated 100-unit boxes to fully prevent ambient trace surface oxidation or passivation of the active core contact faces.
IMPORTANT NOTICE: Components must be stored and manipulated under dry room or standard glovebox frameworks with a relative moisture index of ≤ 70% RH. Maintain stable environmental temperature thresholds between 5°C and 25°C. Technicians must strictly apply ESD/nitrile protection protocols to prevent organic residue or sweat-induced cross-contamination on the active metallic or adhesive faces.
TAILORED SOLUTIONS FOR RESEARCH
Contact our engineering team for technical support or official quotations.
EMAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

These anode tabs require storage in sealed packaging to maintain adhesive and barrier integrity over the 12-month shelf life. The nickel plating ensures compatibility with carbonate-based electrolytes and prevents corrosion during extended exposure at elevated temperatures.

  • Electrolyte and Thermal Exposure Constraints: The tab must not exhibit corrosion or delamination after submersion in standard electrolyte at 85°C for 4 hours.
  • Mechanical Bending Constraint: The tab must endure at least 7 cycles of 180° reverse bending without structural failure.
  • Storage Constraint: Store in sealed, validated packaging to preserve shelf life of 12 months.

Does the nickel plating on ATOMFAIR battery anode tabs introduce any measurable increase in electrical resistance compared to bare copper tabs for high-rate applications?

The nickel plating acts as a protective barrier without significantly compromising conductivity, leveraging copper's superior low ohmic internal resistance. The tabs are validated to withstand 4 hours in electrolyte at 85°C with no delamination or corrosion, ensuring the bimetallic architecture maintains low resistance under extreme high-ampere C-rate profiles. This design is explicitly tailored for high-power pouch cell assembly and multi-ampere charging kinetics where corrosion resistance is critical.

What electrolyte chemistries are compatible with the ATOMFAIR Ni-plated copper tabs in terms of corrosion resistance?

The nickel-plated copper tabs are compatible with advanced non-aqueous electrolyte matrices used in lithium-ion and lithium-metal pouch cells. The product specification confirms no delamination or corrosion after 4 hours of electrolyte exposure at 85°C, demonstrating robust resistance against aggressive organic environments. This makes them suitable for high-drain rate electrochemical testing and validation studies with typical carbonate- or ether-based electrolytes.

What are the required storage conditions for ATOMFAIR Ni-plated copper battery tabs to prevent surface oxidation?

Store tabs in their sealed hermetic packaging under dry room or standard glovebox conditions with relative humidity at or below 70% RH and a stable temperature between 5°C and 25°C. Technicians must apply ESD/nitrile protection protocols to prevent organic residue or sweat-induced cross-contamination on the active metallic or adhesive faces. Following these conditions ensures the 12-month shelf life under sealed validation is maintained.

This nickel-plated copper anode tab offers a high-conductivity copper core with nickel protective barrier and DNP adhesive for durable pouch cell assembly, though its fixed 3×0.1mm geometry and strict dry-room storage requirements limit flexibility.

Positive

  • Bimetallic dual-layer advantage: Integrates low ohmic resistance of copper with corrosion-resistant nickel, optimized for high-rate cycling and electrolyte compatibility.
  • Thermal-chemical hermetic shielding: DNP black polymer film prevents delamination under extreme hot-pressing and aggressive organic electrolytes.

Trade-offs

  • Stringent storage environment required: Must be stored at 5–25°C, ≤70% RH in dry room or glovebox; requires ESD/nitrile handling protocols.
  • Fixed standardized geometry: Default dimensions are 3.0 × 0.1 mm; alternative sizes require custom request and potential lead time.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

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