ATOMFAIR® NI-PLATED COPPER BATTERY ANODE TABS (3 × 0.1 MM)

RESEARCH GRADE MATERIAL

Product Overview

ATOMFAIR® premium research-grade **nickel-plated copper tabs** deliver an advanced bimetallic architecture for state-of-the-art **pouch cell engineering** and multi-ampere electrode evaluation scenarios. Utilizing a standardized geometry of **3 × 0.1 mm**, the high-performance core copper substrate provides unparalleled current density thresholds while the external passivated surface guarantees exceptional chemical and electrolyte compatibility. Pre-integrated with high-bond DNP adhesive film, these durable terminal components mitigate thermal-mechanical stress during intense high-rate cycling analysis, offering corporate R&D divisions and academic faculties uniform baseline conductivity via optimized **ni-plated copper** integration that remains free from degradation.

Technical Specifications

PARAMETER	DETAILS
Substrate Material	High-Purity Copper (Cu) Core with Precision Electroplated Nickel (Ni) Protective Barrier
Default Physical Dimensions	3.0 mm (Width) × 0.1 mm (Thickness)
Polymer Adhesive Interface	DNP Black High-Performance Film (Default)
Mechanical Flexibility	180° Reverse Bending Cycles ≥ 7 Times
Corrosion & Bonding Resistance	No delamination/corrosion after 4 hours in electrolyte at 85°C
Standard Packing Unit	100 Pieces per Box
Shelf Life & Warranty	12 Months (Under sealed validation)
Alternative Options	Explore our related catalog or custom dimensions. For urgent technical custom requests or bulk inquiries, please contact our support team.

Key Features & Advantages

Bimetallic Dual-Layer Advantage: Integrates the superior low ohmic internal resistance of copper with the anti-corrosive properties of nickel, tailored specifically for extreme high-ampere C-rate profiles.
Thermal-Chemical Hermetic Shielding: Default DNP black polymer configuration withstands extreme hot-pressing schedules, preventing any cross-layer interface delamination in aggressive organic environments.
Fatigue-Resistant Structural Integrity: Achieves a mechanical rating of ≥ 7 alternate 180° bends, shielding inner core tracks from structural fracturing during continuous cell-stacking workflows.
Standardized High-Volume Packaging: Provided in expanded 100-piece box arrays to maximize cost-efficiency and ensure continuity throughout continuous pilot line assembly loops.

APPLICATION SCOPE: Explicitly optimized for high-power pouch cell assembly, high-drain rate electrochemical testing, multi-ampere charging kinetics modeling, and validation studies for advanced non-aqueous electrolyte matrices within cleanrooms and university institutions.

PACKAGING: Sealed hermetically in dedicated 100-unit boxes to fully prevent ambient trace surface oxidation or passivation of the active core contact faces.

IMPORTANT NOTICE: Components must be stored and manipulated under dry room or standard glovebox frameworks with a relative moisture index of ≤ 70% RH. Maintain stable environmental temperature thresholds between 5°C and 25°C. Technicians must strictly apply ESD/nitrile protection protocols to prevent organic residue or sweat-induced cross-contamination on the active metallic or adhesive faces.

TAILORED SOLUTIONS FOR RESEARCH

Contact our engineering team for technical support or official quotations.

EMAIL: inquiry@atomfair.com

Manufacturer: Atomfair LLC

Brand: ATOMFAIR®

Purity Copper Core

DNP Nickel-Plated Copper Anode Tabs 3×0.1 mm ATOMFAIR®