Atomfair High Flexibility FCF Copper Foil, Fold-Resistant for Wearable Devices

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Atomfair FCF (9±5um) for FPC/FCCL has high ductility, low roughness, & strong peel strength. Grease-free, anti-folding, bonds well with TPI. Ideal for FPC, consumer electronics, wearables & automotive electronics.

SKU: AFMSTEOC261
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Description

Product Details of Atomfair Flexible Electrolytic Copper Foil (FCF)

1. Basic Product Information

1.1 Product Overview

Atomfair Flexible Electrolytic Copper Foil (FCF) is specifically engineered for the flexible printed circuit board (FPC) and flexible copper-clad laminate (FCCL) industries. Manufactured via an electrolytic process, it is oil-free and outperforms standard copper foil in ductility, peel strength, and surface smoothness/fineness.
With excellent fold resistance and strong high-temperature compatibility with TPI materials, this high-density product is available in black or red surface colors, perfectly suited for flexible material precision processing.

1.2 Product Specifications

Project
Parameter Range
Thickness
9um – 35um
Width Tolerance
0 – +2mm
Core Specification
Inner Diameter: 79mm (3 inches)
Surface Color
Black, Red

1.3 Core Performance (Compliant with IPC-4562-2000 Standard)

Performance Indicator
Unit
9um
12um
18um
35um
Copper Content
%
≥99.8
≥99.8
≥99.8
≥99.8
Surface Density
g/m²
80±3
107±3
153±5
283±7
Tensile Strength (23℃, Room Temperature)
Kg/mm²
≥28
≥28
≥28
≥28
Tensile Strength (180℃, High Temperature)
Kg/mm²
≥15
≥15
≥15
≥18
Elongation (23℃, Room Temperature)
%
≥5.0
≥5.0
≥6.0
≥5.0
Elongation (180℃, High Temperature)
%
≥6.0
≥6.0
≥8.0
≥8.0
Glossy Surface Roughness (Ra)
um
≤0.43
≤0.43
≤0.43
≤0.43
Matte Surface Roughness (Rz)
um
≤2.5
≤2.5
≤2.5
≤2.5
Peel Strength (23℃, Room Temperature)
Kg/cm
≥0.77
≥0.8
≥0.8
≥0.8
Degradation Rate (18% RH, 1hr, 25℃)
%
≤7.0
≤7.0
≤7.0
≤7.0
Discoloration Resistance (200℃, 1.0hr)
Good
Good
Good
Good
Tin Bleaching Performance (290℃)
Sec
≥20
≥20
≥20
≥20
Appearance (Spots/Copper Powder)
None
None
None
None
Pinholes
EA
Zero
Zero
Zero
Zero

1.4 Product Advantages

1.4.1 Exceptional Flexibility

High ductility and superior fold resistance enable reliable performance in repeated bending scenarios (e.g., FPC applications) without breakage or damage, meeting the core demands of flexible electronics.

1.4.2 Superior Composite Performance

Oil-free electrolytic manufacturing eliminates grease residues, ensuring tight bonding with flexible substrates like TPI under high-temperature conditions and enhancing overall product stability.

1.4.3 Excellent Processability

Low surface roughness, high finish, and outstanding etching performance collectively meet the high-precision processing requirements of fine-circuit FPC, supporting intricate circuit design.

1.4.4 Stable & Reliable Quality

High copper content guarantees excellent electrical conductivity. Zero pinholes, no appearance defects, and high-temperature discoloration resistance ensure compliance with industry high standards.

2. Product Applications

As a core material for the FPC industry, FCF is widely used in three key areas:
FCCL Manufacturing: Provides conductive and structural support for flexible laminates, the foundational component of FPC.
Fine-Circuit FPC Production: Creates precision flexible circuits for consumer electronics (mobile phones, laptops, etc.).
Optoelectronics: Ensures stable optoelectronic signal transmission in applications like LED flip-chip films, leveraging its balanced flexibility and conductivity.
It also extends to high-end fields requiring flexible circuits, including wearable devices and automotive electronics.
Note: All performance parameters are tested under standard conditions (23℃, 1 atm). For customized thicknesses, color options, or compatibility tests with specific substrates, please contact our technical team.
If you’re interested, have any questions, or have specific customization requirements, please feel free to contact us at inquiry@atomfair.com.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).