Description
Product Details of Atomfair Nickel-Plated Copper Foil
1. Basic Product Information
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Specification Items
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Weldable Nickel-Plated Copper Foil
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Non-weldable Nickel-Plated Copper Foil
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Product Name
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Atomfair Weldable Nickel-Plated Copper Foil
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Atomfair Non-weldable Nickel-Plated Copper Foil
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Base Material
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High-precision rolled copper foil (JIS C1100 & ASTM C11000), copper content ≥ 99.96%
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High-precision rolled copper foil (JIS C1100 & ASTM C11000), copper content ≥ 99.96%
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Substrate Thickness Range
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0.012-0.15 mm (0.00047-0.0059 inches)
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0.012-0.15 mm (0.00047-0.0059 inches)
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Substrate Width Range
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≤ 600 mm (≤ 23.62 inches)
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≤ 600 mm (≤ 23.62 inches)
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Substrate Customization
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Available as per customer requirements
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Available as per customer requirements
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Nickel Layer Thickness
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≥ 0.4 um
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≥ 0.2 um
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Nickel Layer Composition
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80%-90% nickel (adjustable to match customer welding processes)
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100% pure nickel
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Nickel Layer Surface Resistance
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≤ 0.1 Ω
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0.05-0.07 Ω
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Adhesion Grade
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5B (compliant with ASTM D3359 standard)
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5B (compliant with ASTM D3359 standard)
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Mechanical Performance Retention
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Tensile strength degradation ≤ 10% after plating; Elongation degradation ≤ 6% after plating
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Tensile strength degradation ≤ 10% after plating; Elongation degradation ≤ 6% after plating
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1.1 Core Features
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Surface & Shape: Smooth surface and flat profile, ensuring consistent quality for downstream processing.
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Protective Properties: Excellent wear resistance, corrosion resistance, and rust prevention; strong chemical stability, resistant to oxidation and discoloration at temperatures below 600℃.
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Layer Adhesion: The nickel plating layer has strong adhesion to the copper substrate and is not easy to peel off.
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Process Compatibility: Degreased surface enables easy compounding and bonding with other materials.
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Customization Support: Offers customized processing services such as annealing and slitting to meet diverse customer needs.
2. Product Applications
2.1 Electronic & Electrical Industry
2.2 Battery Industry
2.3 Communication Equipment Field
2.4 Hardware Manufacturing Industry
2.5 Other Fields
This product comprises a high-purity copper foil substrate with a nickel plating layer optimized for wear resistance and welding compatibility. The variant-specific nickel composition and thickness impose constraints on welding processes and require careful handling to preserve surface integrity.
- Nickel Layer Composition for Welding: The weldable variant uses a nickel layer composition of 80-90% nickel to match customer welding processes, while the non-weldable variant uses 100% pure nickel.
- Nickel Layer Thickness: The weldable variant requires a minimum nickel thickness of 0.4 µm and the non-weldable variant requires a minimum of 0.2 µm for proper performance.
- Substrate Customization: Substrate thickness and width can be customized per customer requirements within the specified ranges.
- Surface Condition: The foil undergoes degreasing treatment and should remain free of surface contaminants to maintain wear resistance and weldability.
How does the nickel layer composition and thickness affect the weldability versus electrical conductivity trade-off in Atomfair nickel-plated copper foil?
The weldable variant uses an 80–90% nickel layer at ≥0.4 µm thickness to optimize laser or ultrasonic welding performance, while the non-weldable variant uses 100% pure nickel at ≥0.2 µm for lower surface resistance (0.05–0.07 Ω vs ≤0.1 Ω). This allows users to prioritize either robust joint formation or minimal electrical loss depending on the application, with mechanical performance retention guaranteed (tensile strength degradation ≤10%, elongation degradation ≤6% after plating).
What are the critical compatibility considerations when integrating Atomfair nickel-plated copper foil into multilayer laminate or bonding processes?
The foil's degreased surface ensures excellent adhesion with adhesives and encapsulation materials, and it supports customized annealing and slitting to meet tight dimensional tolerances. The base material is high-purity rolled copper foil (JIS C1100 / ASTM C11000, Cu≥99.96%), which is compatible with standard PCB and flexible circuit manufacturing, but the nickel plating thickness (≥0.2 or ≥0.4 µm) and purity must be matched to the specific joining technique (e.g., laser welding, soldering or ultrasonic bonding).
What are the recommended storage and handling conditions to maintain the surface integrity of Atomfair nickel-plated copper foil?
The nickel layer provides excellent oxidation and corrosion resistance below 600°C, but for long-term storage, the foil should be kept in a clean, dry environment with moderate humidity to prevent moisture-induced galvanic corrosion. Handling with clean gloves is advised to avoid contaminating the degreased surface, which would compromise subsequent bonding or plating steps, and the foil's adhesion grade (5B per ASTM D3359) ensures the nickel layer remains intact under proper handling.
Atomfair's nickel-plated copper foil delivers robust wear and corrosion resistance with adhesion grade 5B, but its thin substrate (down to 0.012 mm) demands careful handling, and the weldable variant's nickel composition (80-90% Ni) requires process-specific adjustment.
Positive
- Strong nickel layer adhesion: The nickel plating achieves adhesion grade 5B per ASTM D3359, ensuring resistance to peeling under mechanical stress and supporting reliable performance in multilayer assemblies.
- High-temperature oxidation resistance: The foil resists oxidation and discoloration up to 600°C, allowing use in elevated-temperature environments without compromising surface integrity or conductivity.
Trade-offs
- Thin substrate handling requirements: With substrate thickness as low as 0.012 mm, the foil is mechanically delicate and may require specialized slitting and lamination equipment to avoid tearing or deformation during downstream processing.
- Variant-dependent nickel composition: The weldable variant uses 80-90% nickel, adjustable to match welding processes, meaning the standard composition may not be universally suitable and process tuning is needed to achieve optimal joint integrity.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
