Atomfair High Purity Copper Bonding Wire (Cu) – 18μm & 25μm Diameter

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Premium copper bonding wire designed for high-performance electronic applications. Offers excellent conductivity and reliability for semiconductor and microelectronic bonding. Available in precise diameters for various bonding requirements.

SKU: AFMSDITJ685
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Description

Premium copper bonding wire designed for high-performance electronic applications. Offers excellent conductivity and reliability for semiconductor and microelectronic bonding. Available in precise diameters for various bonding requirements.

Product Type Diameter Length per Spool Packaging Pack Size
Copper Bonding Wire φ18μm 1000m Spool 1
Copper Bonding Wire φ25μm 1000m Spool 1

If you are interested or have any questions, please contact us at inquiry@atomfair.com

Disclaimer: Sold exclusively for laboratory research.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).