Description
This Copper Aluminum (CuAl) alloy sputtering target is manufactured using powder metallurgy, offering high purity (99.5%) and precise composition (90/10 wt%). Ideal for thin film deposition applications, it comes in a standard size of 50x50x2mm with secure packaging.
| Material | Composition (wt%) | Purity | Dimensions (mm) | Manufacturing Process | Packaging | Packaging Size |
|---|---|---|---|---|---|---|
| Copper Aluminum Alloy (CuAl) | Cu/Al = 90/10 | 99.5% | 50 × 50 × 2 | Powder Metallurgy | Piece | 1 |
If you are interested or have any questions, please contact us at inquiry@atomfair.com
Disclaimer: Sold exclusively for laboratory research.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
