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Atomfair ultra-thin thickness silicon wafer 1″ 50um Type P Boron <100> Resistivity 1-40 ohm-cm Surface Finish SSP/DSP

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Ultra-thin silicon wafers are monocrystalline wafers made via precision thinning (grinding, polishing, etching) with significantly reduced thickness (typically tens to several microns, application-dependent). Featuring thinness, low power consumption and high integration adaptability, they fit miniaturization needs, ideal for flexible electronics, advanced packaging, MEMS, thin solar cells and high-frequency RF chips.

SKU: AFMSPUMA105
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Description

Properties Specification
Diameter 1″
Thickness 50um
Type P
Doping Boron
Orientation <100>
Resistivity 1-40 ohm-cm
Surface Single/Double-side polished
Reference Edge No

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

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