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Atomfair High Purity Copper-Aluminum-Tin Alloy (CuAlSn) Lump – 99.9% Purity, Cu:Al:Sn = 93:5:2 wt%
This Copper-Aluminum-Tin (CuAlSn) alloy lump offers high purity (99.9%) with a precise composition ratio of 93% Cu, 5% Al, and 2% Sn. The irregularly shaped lumps are ideal for metallurgical applications requiring specific alloy properties.
Description
This Copper-Aluminum-Tin (CuAlSn) alloy lump offers high purity (99.9%) with a precise composition ratio of 93% Cu, 5% Al, and 2% Sn. The irregularly shaped lumps are ideal for metallurgical applications requiring specific alloy properties.
| Product Name | Composition | Purity | Form | Composition Tolerance | Packaging | Pack Size |
|---|---|---|---|---|---|---|
| Copper-Aluminum-Tin Alloy Lump | Cu:Al:Sn = 93:5:2 wt% | 99.9% | Irregular lump | ±0.5% | kg | 1 |
If you are interested or have any questions, please contact us at inquiry@atomfair.com
Disclaimer: Sold exclusively for laboratory research.
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