Description
This Copper-Aluminum-Tin (CuAlSn) alloy lump offers high purity (99.9%) with a precise composition ratio of 93% Cu, 5% Al, and 2% Sn. The irregularly shaped lumps are ideal for metallurgical applications requiring specific alloy properties.
| Product Name | Composition | Purity | Form | Composition Tolerance | Packaging | Pack Size |
|---|---|---|---|---|---|---|
| Copper-Aluminum-Tin Alloy Lump | Cu:Al:Sn = 93:5:2 wt% | 99.9% | Irregular lump | ±0.5% | kg | 1 |
If you are interested or have any questions, please contact us at inquiry@atomfair.com
Disclaimer: Sold exclusively for laboratory research.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
