Description
Premium silver bonding wire designed for precision applications, available in two high-purity options (88% and 96% Ag). Features a consistent 18μm diameter and comes in convenient 500m spools. Ideal for semiconductor, electronics, and microelectronic bonding processes.
| Material | Purity | Diameter | Length per Spool | Packaging | Pack Size |
|---|---|---|---|---|---|
| Silver Bonding Wire | 88% Ag | 18μm | 500m | Spool | 1 |
| Silver Bonding Wire | 96% Ag | 18μm | 500m | Spool | 1 |
If you are interested or have any questions, please contact us at inquiry@atomfair.com
Disclaimer: Sold exclusively for laboratory research.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
