Product Details of Atomfair Inverted Treatment Electrolytic Copper Foil (RTF)

1. Basic Product Information

1.1 Product Overview

Atomfair Inverted Treatment Electrolytic Copper Foil (RTF) is a double-sided product with differential roughness treatments. It significantly enhances peel strength on both sides, making it ideal as an intermediate layer for bonding with other materials.

The double-sided differentiated design allows the side with a thinner rough layer to be more easily etched. The roller-treated surface features higher roughness, ensuring stronger adhesion to dielectric materials. Its matte surface enables direct photoresist bonding without pretreatment, delivering excellent bonding resistance.

1.2 Product Specifications

Project	Parameter Range
Nominal Thickness	12um (1/3OZ), 18um (1/2OZ), 35um (1OZ)
Maximum Width	1295mm
Compatible Substrate	FR-4

1.3 Core Performance

Performance Indicator	Unit	12um (1/3OZ)	18um (1/2OZ)	35um (1OZ)
Copper Content	%	≥99.8	≥99.8	≥99.8
Surface Density	g/m²	107±3	153±5	283±5
Tensile Strength (25℃, Room Temperature)	Kg/mm²	≥28.0	≥28.0	≥28.0
Tensile Strength (180℃, High Temperature)	Kg/mm²	≥15.0	≥15.0	≥18.0
Elongation (25℃, Room Temperature)	%	≥5.0	≥6.0	≥8.0
Elongation (180℃, High Temperature)	%	≥6.0	≥6.0	≥6.0
Glossy Surface Roughness (Ra)	um	≤0.6	≤0.7	≤0.8
Matte Surface Roughness (Rz)	um	≤4.0	≤5.0	≤6.0
Peel Strength (23℃, Room Temperature)	Kg/cm	≥1.1	≥1.2	≥1.5
Degradation Rate (18% RH, 1hr, 25℃)	%	≤5.0	≤5.0	≤5.0
Discoloration Resistance (190℃, 1.0hr)	–	No Discoloration	No Discoloration	No Discoloration
Tin Bleaching Performance (290℃)	Sec	≥20	≥20	≥20
Pinholes	EA	None	None	None

1.4 Product Advantages

1.4.1 Superior Double-Sided Adhesion

Electroplating technology precisely controls the size and distribution of copper nodules. Double-sided differential roughening ensures high peel strength, with the roller-treated surface offering exceptional adhesion to dielectric materials.

1.4.2 High Processing Efficiency

The matte surface enables direct photoresist bonding without mechanical or chemical pretreatment, shortening the production cycle. The thinner rough layer side allows easier etching, improving processing precision.

1.4.3 Reliable Usage Safety

Smooth surface inverted treatment reduces post-lamination copper foil roughness. Combined with excellent etching performance, it minimizes short-circuit risks and ensures consistent product quality.

1.4.4 Broad Adaptability

Supports direct multi-layer lamination and maintains stable performance at high temperatures, making it suitable for diverse precision processing scenarios.

2. Product Applications

With high adhesion, excellent etching performance, and stable high-temperature characteristics, RTF is widely used in manufacturing high-frequency products and inner laminated boards. It is particularly compatible with equipment requiring strict signal transmission and structural stability, such as 5G base stations and automotive radars.

Additionally, it is ideal for inner-layer production of various high-precision printed circuit boards (PCBs), providing critical support for equipment high-frequency performance and durability.

Note: All performance parameters are tested under standard conditions (25℃, 1 atm). For customized specifications, compatibility tests with non-FR-4 substrates, or technical samples, please contact our team.

If you’re interested, have any questions, or have specific customization requirements, please feel free to contact us at inquiry@atomfair.com.

RTF Electrolytic Copper Foil

Atomfair Differential Roughness RTF Copper Foil, FR-4 Compatible for High-Frequency PCBs