ATOMFAIR® CUSN10

RESEARCH GRADE MATERIAL

Product Overview

Optimize structural consistency and mechanical reliability in high-temperature component validation using our premier spherical alloy framework. This powder system establishes superior layer-to-layer integrity during additive manufacturing, eliminating microstructural variance and serving as a stable high-performance baseline platform to meet targeted industrial pricing milestones.

Technical Specifications

PARAMETER	DETAILS
1. Chemical Composition (wt.%)
Copper (Cu) / Tin (Sn)	Balance / 9.0 – 11.5%
Phosphorus (P) / Nickel (Ni)	≤1.0% / ≤0.10%
Silicon (Si) / Antimony (Sb)	≤0.02% / ≤0.05%
Iron (Fe) / Lead (Pb)	≤0.1% / ≤0.25%
Aluminum (Al) / Zinc (Zn)	≤0.01% / ≤0.05%
Manganese (Mn) / Sulfur (S) / Oxygen (O)	≤0.05% / ≤0.05% / ≤0.1%
2. Core Physical Design & Properties
Particle Size Range D10	≥15 μm
Particle Size Range D50	30 – 40 μm
Particle Size Range D90	≤60 μm
Sphericity	≥0.90
Apparent Density	≥4.2 g/cm³
Tap Density	≥4.5 g/cm³
Flowability	≤25 s/50g
3. As-Deposited Mechanical Parameters (Room Temperature)
Tensile Strength	≥520 MPa
Yield Strength	≥400 MPa
Elongation	≥30.0%
Relative Density	≥99.5%
Hardness	≥170 HV
Manufacturing Rules	Processed under strict aerospace and mechanical industries standards
Alternative Options	Explore our related catalog or custom dimensions. For urgent technical custom requests or bulk inquiries, please contact our support team.

Key Features & Advantages

Homogeneous Material Purity: Features an uncompromised structural configuration with highly uniform elemental distribution across the matrix.
Enhanced Operational Efficiency: Specifically engineered to demonstrate superior electrochemical performance, significantly boosting transfer kinetics at targeted bands.
Optimized Sintering/Microstructure: Advanced synthesis allows for lower required operating temperatures and ideal grain boundary integration during cell fabrication.

APPLICATION SCOPE: Used for manufacturing wear-resistant parts operating under high load, high sliding speed, and elevated temperatures, such as blades, gears, and other complex structures in aerospace and mechanical engineering applications.

PACKAGING: Sealed argon-filled protective bottles or specialized vacuum containment drums.

IMPORTANT NOTICE: This product is highly sensitive to ambient exposure. Keep containers tightly sealed or handle exclusively within an anhydrous inert gas environment to prevent phase contamination or degradation before thermal validation.

TAILORED SOLUTIONS FOR RESEARCH

Contact our engineering team for technical support or official institutional quotations.

EMAIL: inquiry@atomfair.com

Manufacturer: Atomfair LLC

Brand: ATOMFAIR®

CuSn10 powder

CuSn10 Spherical Tin Bronze Alloy Powder