ATOMFAIR® CU

RESEARCH GRADE MATERIAL

Product Overview

Optimize structural consistency and mechanical reliability in high-temperature component validation using our premier spherical alloy framework. This powder system establishes superior layer-to-layer integrity during additive manufacturing, eliminating microstructural variance and serving as a stable high-performance baseline platform to meet targeted industrial pricing milestones.

Technical Specifications

PARAMETER	DETAILS
1. Chemical Composition (wt.%)
Copper (Cu) / Iron (Fe)	Balance / ≤0.005%
Sulfur (S) / Lead (Pb)	≤0.005% / ≤0.005%
Antimony (Sb) / Oxygen (O)	≤0.002% / ≤0.05%
Other Impurities	≤0.1%
2. Core Physical Design & Properties
Particle Size Range D10	≥10 μm
Particle Size Range D50	25 – 35 μm
Particle Size Range D90	≤60 μm
Sphericity	0.9
Apparent Density	≥5.0 g/cm³
Tap Density	≥5.2 g/cm³
Flowability	≤22 s/50g
3. Mechanical Parameters (Room Temperature Test)
Tensile Strength	≥240 MPa
Yield Strength	≥165 MPa
Elongation	≥30%
Manufacturing Rules	Processed under strict aerospace industry compliance standards conditions
Alternative Options	Explore our related catalog or custom dimensions. For urgent technical custom requests or bulk inquiries, please contact our support team.

Key Features & Advantages

Homogeneous Material Purity: Features an uncompromised structural configuration with highly uniform elemental distribution across the matrix.
Enhanced Operational Efficiency: Specifically engineered to demonstrate superior electrochemical performance, significantly boosting transfer kinetics at targeted bands.
Optimized Sintering/Microstructure: Advanced synthesis allows for lower required operating temperatures and ideal grain boundary integration during cell fabrication.

APPLICATION SCOPE: Highly optimized for rocket engine nozzle liners, integrated circuit heat dissipation substrates, induction coils, vacuum device electrodes, and precision conformal cooling channels in molds.

PACKAGING: Sealed argon-filled protective bottles or specialized vacuum containment drums.

IMPORTANT NOTICE: This product is highly sensitive to ambient exposure. Keep containers tightly sealed or handle exclusively within an anhydrous inert gas environment to prevent phase contamination or degradation before thermal validation.

TAILORED SOLUTIONS FOR RESEARCH

Contact our engineering team for technical support or official institutional quotations.

EMAIL: inquiry@atomfair.com

Manufacturer: Atomfair LLC

Brand: ATOMFAIR®

Cu powder

Cu Spherical Pure Copper Powder