Description
Product Details of Atomfair Standard Electrolytic Copper Foil (STD)
1. Basic Product Information
1.1 Product Overview
Atomfair Standard Electrolytic Copper Foil (STD, Type E per IPC-4562) is crafted from high-purity copper, delivering exceptional electrical conductivity, easy etching, and superior electromagnetic interference (EMI) & microwave shielding capabilities. Manufactured via an advanced electrolytic process, it offers a maximum width of 1290mm and a flat profile for seamless bonding with various materials.
Boasting high-temperature oxidation resistance and corrosion resistance, it excels in harsh environments with strict lifespan requirements. Its quality fully complies with IPC-4562 Grade II and Grade III standards, meeting rigorous printed circuit board (PCB) industry demands.
1.2 Product Specifications
| Project | Parameter Range |
|---|---|
| Nominal Thickness | 9um, 12um (1/3oz), 18um, 35um, 50um, 70um (2oz), 105um, 140um (4oz) |
| Maximum Width | 1290mm |
| Width Tolerance | 0 ?+2mm |
| Core Specification | Inner Diameter: 76mm (3 inches) |
1.3 Core Performance (Compliant with IPC-4562-2000 Standard)
| Performance Indicator | Unit | 9um | 12um | 18um | 35um | 50um | 70um | 105um | 140um |
|---|---|---|---|---|---|---|---|---|---|
| Copper Content | % | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 |
| Surface Density | g/m?/td> | 80±3 | 107±3 | 153±5 | 283±7 | 440±8 | 585±10 | 875±15 | 1160±20 |
| Tensile Strength (23?, Room Temperature) | Kg/mm?/td> | ≥28 | ≥28 | ≥28 | ≥28 | ≥28 | ≥28 | ≥28 | ≥28 |
| Tensile Strength (180?, High Temperature) | Kg/mm?/td> | ≥15 | ≥15 | ≥15 | ≥18 | ≥18 | ≥20 | ≥20 | ≥20 |
| Elongation (23?, Room Temperature) | % | ≥5.0 | ≥5.0 | ≥6.0 | ≥10 | ≥10 | ≥10 | ≥10 | ≥10 |
| Elongation (180?, High Temperature) | % | ≥6.0 | ≥6.0 | ≥8.0 | ≥8.0 | ≥8.0 | ≥6.0 | ≥8.0 | ≥8.0 |
| Glossy Surface Roughness (Ra) | um | ≤0.43 | ≤0.43 | ≤0.43 | ≤0.43 | ≤0.43 | ≤0.43 | ≤0.43 | ≤0.43 |
| Matte Surface Roughness (Rz) | um | ≤3.5 | ≤3.5 | ≤3.5 | ≤3.5 | ≤3.5 | ≤3.5 | ≤3.5 | ≤3.5 |
| Peel Strength (23?, Room Temperature) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.9 | ≥1.0 | ≥0.77 | ≥1.5 | ≥2.0 | ≥2.2 |
| Degradation Rate (18% RH, 1hr, 25?) | % | ≤7.0 | ≤7.0 | ≤7.0 | ≤7.0 | ≤7.0 | ≤7.0 | ≤7.0 | ≤7.0 |
| Discoloration Resistance (200?, 1.0hr) | – | Good | Good | Good | Good | Good | Good | Good | Good |
| Tin Bleaching Performance (290?) | Sec | ≥20 | ≥20 | ≥20 | ≥20 | ≥20 | ≥20 | ≥20 | ≥20 |
| Appearance (Spots/Copper Powder) | – | None | None | None | None | None | None | None | None |
| Pinholes | EA | Zero | Zero | Zero | Zero | Zero | Zero | Zero | Zero |
1.4 Product Advantages
1.4.1 Superior Electromagnetic Shielding
High-purity copper composition ensures exceptional electrical conductivity, providing reliable shielding against EMI, microwave interference, and static interference?ritical for precision electronic applications requiring signal integrity.
1.4.2 Excellent Processability
Features an equiaxed fine-grained spherical structure 2, which shortens circuit etching time and minimizes uneven side etching. A specialized surface roughening process creates a shallow, rounded profile (vs. jagged traditional surfaces) to prevent electrical breakdown and ensure processing consistency.
1.4.3 Outstanding Adhesion & Durability
Flat sheet profile enables seamless bonding with substrates. High peel strength guarantees long-term adhesion stability, while zero copper powder transfer supports the production of PCB products with sharp, clear circuit patterns. High-temperature oxidation and corrosion resistance ensure performance in harsh operating environments.
1.4.4 Broad Adaptability
Offers a maximum width of 1290mm and a comprehensive thickness range (9um?40um) with customization options. Additional properties including moisture resistance, chemical corrosion resistance, thermal conductivity, and UV resistance make it suitable for diverse industrial needs.
2. Product Applications
Leveraging multi-dimensional performance advantages, STD copper foil serves key high-end markets:
- Circuit Manufacturing: Critical material for high-power PCBs and high-frequency boards in automotive, power electronics, telecommunications, military, and aerospace industries?here reliability and performance under stress are paramount.
- Electromagnetic Shielding: Meets shielding requirements for transformers, cables, mobile devices, computers, and medical equipment. Provides core protection for signal stability and extended equipment service life in sensitive electronic systems.
Note: All performance parameters are tested under standard conditions (23?, 1 atm). As an IPC-compliant supplier, we provide detailed certification documents. For customized specifications or sample testing, please contact our technical team.
If you?e interested, have any questions, or have specific customization requirements, please feel free to contact us at inquiry@atomfair.com.
