Revolutionizing semiconductor manufacturing through EUV mask defect mitigation and 3D monolithic integration
EUV lithography
mask defects
3D integration
semiconductor manufacturing
chip scaling
Via quantum dot charge trapping for room-temperature single-photon emitters
quantum dots
single-photon sources
nanophotonics
quantum optics
charge stabilization
Ultra-low power memory devices with ferroelectric hafnium oxide at 3nm scales
neuromorphic computing
thin-film materials
semiconductor physics
energy-efficient electronics
hysteresis optimization
Implementing hybrid bonding for chiplet integration in next-gen processors
hybrid bonding
chiplet integration
semiconductor packaging
3D ICs
high-performance computing
Gate-all-around nanosheet transistors for sub-3nm logic node performance scaling
nanosheet transistors
logic scaling
Moore's Law
semiconductor
thermal management
Computational lithography optimizations for EUV patterning at Josephson junction frequencies
computational lithography
EUV
Josephson junctions
quantum interference
superconducting devices
Reducing semiconductor yield loss through EUV mask defect mitigation strategies
EUV lithography
semiconductor manufacturing
mask defects
yield improvement
nanofabrication
Using carbon nanotube vias to overcome interconnect bottlenecks in next-generation 3D chip stacking
carbon nanotubes
3D integration
interconnects
semiconductor scaling
thermal dissipation
Employing ruthenium interconnects for sub-2nm node reliability and electromigration resistance
ruthenium interconnects
electromigration
semiconductor reliability
advanced nodes
material science
With self-heating mitigation in 3nm nodes using graphene thermal vias
nanoelectronics
thermal management
advanced materials
chip design
With self-heating mitigation in 3nm nodes through plasmonic heat dissipation
3nm nodes
plasmonics
thermal management
semiconductors
nanoelectronics
Using gate-all-around nanosheet transistors for next-generation quantum computing chips
gate-all-around transistors
quantum computing
nanosheet tech
chip scaling
coherence time