Advanced semiconductor and nanotechnology development

Enhancing solar cell efficiency through germanium-silicon strain engineering at plasma oscillation frequencies

solar cells strain engineering germanium-silicon plasma oscillations heterostructures

Digital twin implementation for defect prediction in gate-all-around nanosheet transistor fabrication

digital twin nanosheet transistors semiconductor yield process optimization 3D ICs

Mitigating thermal bottlenecks in 3D ICs with back-end-of-line thermal management materials

thermal management 3D ICs back-end-of-line heat dissipation semiconductor packaging

Enhancing chip performance via backside power delivery networks in 3nm nodes

backside power delivery 3nm technology semiconductor performance thermal management chip design

Using gate-all-around nanosheet transistors for low-power neuromorphic computing

nanosheet transistors neuromorphic engineering low-power electronics AI hardware semiconductor design

Through back-end-of-line thermal management in 3D integrated circuits

3D ICs thermal management semiconductor packaging heat dissipation advanced materials

Enhancing computational efficiency in quantum circuits via gate-all-around nanosheet transistors

quantum circuits nanosheet transistors power efficiency computational design semiconductor technology

Exploring ferroelectric hafnium oxide for next-generation non-volatile memory devices

ferroelectric materials hafnium oxide non-volatile memory energy efficiency semiconductor technology

Through hybrid bonding for chiplet integration in next-generation semiconductor devices

hybrid bonding chiplet integration semiconductors 3D packaging interconnect technology

Through lights-out production in fully automated semiconductor fabrication plants

lights-out production semiconductor fabrication automation Industry 4.0 yield optimization

Atomic layer etching precision for 2nm node quantum dot qubit fabrication

atomic layer etching 2nm nodes quantum dots qubit fabrication defect minimization

Enhancing chiplet integration through hybrid bonding for next-gen processors

hybrid bonding chiplets semiconductor 3D integration processor architecture