Advanced semiconductor and nanotechnology development

Through hybrid bonding for chiplet integration in high-performance quantum computing platforms

hybrid bonding chiplet integration quantum computing semiconductor packaging interconnects

Preparing for 2032 processor nodes using diamond-nitrogen vacancy center arrays

diamond NV centers processor nodes quantum sensors semiconductor scaling 2032 technology

Atomic layer etching for defect-free 2nm node semiconductor fabrication

atomic layer etching semiconductor scaling 2nm nodes surface engineering transistor fabrication

Optimizing backside power delivery networks for next-generation 3D chiplet architectures

backside power delivery 3D integration chiplet technology power efficiency advanced packaging

Employing ruthenium interconnects in next-generation semiconductor devices for reduced electromigration

ruthenium interconnects semiconductor scaling electromigration resistance nanoelectronics chip manufacturing

Optimizing transistor performance via backside power delivery networks in 3D ICs

3D ICs power delivery thermal management transistor scaling backside routing

Designing 50-year durability requirements via computational lithography optimizations in semiconductors

durability computational lithography semiconductors aging prediction nanofabrication

Achieving picometer precision in quantum dot placement for next-gen quantum computing

quantum dots picometer precision quantum computing qubit placement nanofabrication

Quantum dot charge trapping in next-generation optical memory devices

quantum dots optical memory charge trapping nanoelectronics data storage

Atomic layer etching of 2nm node quantum dot arrays synchronized with solar cycles

atomic layer etching quantum dots 2nm nodes solar synchronization semiconductor fabrication

Using gate-all-around nanosheet transistors for ultra-low-power next-generation computing chips

nanosheet transistors semiconductor technology low-power computing chip design nanotechnology

Through 3D monolithic integration to achieve high-density memory and logic stacking

3D integration semiconductor stacking memory technology logic circuits miniaturization